Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating Epoxy for Potting, Bonding, Sealing & Coating

Master Bond Polymer System EP30AO is a two component epoxy resin system for high performance potting, bonding, sealing and coating, formulated to cure at room temperature or more rapidly at elevated temperatures with a ten to one (10:1) mix ratio by weight. It has an attractive balance of performance properties including high thermal conductivity, excellent electrical insulation characteristics and superior dimensional stability, as well as outstanding physical strength properties.