Master Bond Inc

Master Bond’s product line consists of epoxy, polyurethane, polyamide, silicone, cyanoacrylate and latex . Master Bond is a leading manufacturer of high quality adhesives, sealants, and coatings. Master Bond caters to the entire spectrum of high-tech applications, including conformal coating, potting & encapsulation, and impregnation. Master Bond’s structural adhesives offer design flexibility and provide excellent bonding performance with a vast array of 3,000 custom designed adhesive formulations.  properties differ in viscosity, cure speed, temperature and chemical resistance, strength, electrical and thermal conductivity. Specific adhesive systems can be designed to meet USP Class VI certification for medical use or NASA requirements for low outgassing. Master Bond recognizes that each application presents unique property requirements that must be met. If a compound is not available in Master Bond’s vast product line to meet those requirements, their experienced research and development team will promptly formulate one. Master Bond products are successfully implemented in medical, optical, aerospace, electronic, and other industries.

 

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  1. B-Staged Film Adhesive/Sealant Featuring Toughness, High Temperature Resistance, Thermal Conductivity and Electrical Isolation

    B-Staged Film Adhesive/Sealant Featuring Toughness, High Temperature Resistance, Thermal Conductivity and Electrical Isolation
    Master Bond FLM36 is a very special film adhesive featuring incomparable strength properties, high temperature resistance and first class thermal conductivity and electrical insulation properties. Based on the Master Bond EP36AO formulation, this film differs from other heat resistant epoxies for it possesses far more toughness and flexibility than conventional high temperature resistant epoxies. Although it has a lower glass transition temperature and is softer above it, FLM36 retains its very high physical strength properties profile up to 500°F. FLM36 combines markedly enhanced thermal and mechanical shock resistance and thermal cycling capabilities.
  2. High Viscosity, UV-Curable System for Bonding, Sealing and Encapsulation Meets NASA Low Outgassing Requirements

    High Viscosity, UV-Curable System for Bonding, Sealing and Encapsulation Meets NASA Low Outgassing Requirements
    Master Bond UV10TKLO-2 is a special one component UV curable epoxy modified system for high performance bonding, sealing and encapsulation. This unique system has passed rigorous testing to meet low outgassing specifications, as per NASA ASTM E-595. UV10TKLO-2 has exceptionally high clarity and cures readily at room temperature when exposed to UV light. The ideal wavelengths for curing are 320-365 nm and the desired energy is 20-40 milliwatts per cm². The UV system is not inhibited by oxygen.
  3. Low Viscosity, One Component, UV Curable Epoxy Based System for High Performance Bonding, Coating and Sealing

    Low Viscosity, One Component, UV Curable Epoxy Based System for High Performance Bonding, Coating and Sealing
    Master Bond UV15 is a high strength, low viscosity, epoxy based UV curable system for bonding, sealing and coating. It is 100% reactive and does not contain any solvents or other volatiles. It is also completely free of any oxygen inhibition. UV15 will cure quickly and easily when exposed to a UV light source with a wavelength range between 320-365 nm, with the optimum at 365 nm.
  4. Master Bond Biocompatible Silicone Compound for Potting and Encapsulation

    Master Bond Biocompatible Silicone Compound for Potting and Encapsulation
    MasterSil 15Med is an optically clear, flexible, tough, high performance potting and encapsulation compound introduced by Master Bond. It exhibits superior electrical insulation properties and very low shrinkage upon cure. MasterSil 151Med is resistant to vibration and shock and has a service operating temperature range of -65°F to +400°F. It meets USP Class VI requirements for medical applications.
  5. Master Bond High Tensile Strength, Toughened Epoxy System

    Master Bond High Tensile Strength, Toughened Epoxy System
    Master Bond Supreme 10HT is a one component system formulated to cure at elevated temperatures. This outstanding epoxy offers tensile shear strengths in excess of 3,600 psi and T-peel strengths up to 30 pli. It is cryogenically serviceable and readily withstands severe thermal cycling along with mechanical shock and vibration.
  6. Master Bond Low Outgassing, Thermally Conductive Epoxy System

    Master Bond Low Outgassing, Thermally Conductive Epoxy System
    Master Bond EP21TCHT-1 is a heat resistant polymer system formulated for high performance bonding and sealing applications. It features high thermal conductivity and superior electrical insulation properties with a service operating temperature range of 4K to 400°F. EP21TCHT-1 is NASA low outgassing certified and is therefore highly recommended for use in vacuum environments.
  7. Master Bond One Component, Heat Curing Epoxy Adhesive

    Master Bond One Component, Heat Curing Epoxy Adhesive
    Master Bond's Supreme 10AOHT-LO features high peel and shear strengths, superior electrical insulation properties and a thermal conductivity of 10 BTU/in/ft²/hr/°F. It has a service operating temperature range of 4K to +400°F. Supreme 10AOHT-LO is resistant to impact, thermal shock, vibration and stress fatigue cracking while meeting NASA low outgassing requirements.
  8. Master Bond One Component LED Curable Adhesive System

    Master Bond One Component LED Curable Adhesive System
    Master Bond LED401 is a highly innovative, one part LED type system that cures fully upon exposure to a 405 nm wavelength light source where the presence of any UV light is minimal or incidental. In fact, this unique system will fully cure tack-free without any oxygen inhibition. This breakthrough technology allows LED401 to be utilised not only as an adhesive, but as a sealant, coating and encapsulation material. This remarkable system can cure in sections up to and beyond 1/8 inch thick upon exposure to the LED light. Since it is a LED curable system, it is intrinsically safer than one requiring UV light for polymerisation, as LED light emitting sources are generally considered to be less hazardous and more user friendly than their comparable UV counterparts.
  9. Master Bond Two Component Epoxy Compound for Cryogenic Applications

    Master Bond Two Component Epoxy Compound for Cryogenic Applications
    EP29LPSP is a two component, low viscosity epoxy system for bonding, sealing and coating. This epoxy not only functions at temperatures as low as 4K, but also withstands cryogenic shocks. Additionally, it meets NASA low outgassing requirements.
  10. Master Bond Two Component USP class VI Epoxy System

    Master Bond Two Component USP class VI Epoxy System
    Master Bond EP42HT-2Med is a room temperature curable two component epoxy, adhesive, sealant, coating and casting material featuring high temperature resistance along with outstanding chemical resistance. It is widely used in the assembly of medical devices due to its capability of withstanding repeated sterilisations and its compliance with the testing requirements of USP Class VI plastics.