Custom Interconnect Ltd (CIL) | Electronics Product Management

We offer a comprehensive range of surface mount electronics assembly services and our assembly area offers a combination of technical proficiency and flexibility. Our surface mount electronics assembly area deal with BGA, 0201 and the placement of bare die components and use leaded, unleaded and HMP solders.

Our surface mount electronics assembly line comprises of:

• 3 Speed Print SP880 AVI Solder paste printers with vision.
• 1 DEK Horizon O2i Solder Paste printer with vision.
• 2 Tyco 1030/1020P in line system with high precision head
• 1 Tyco 1030/1030P in line system with high precision head
• 1 Tyco 1010 in Line 65,000 CPH in-line system
• 1 Tyco 1030/1025P in line system with high precision head
• 2 Tyco 1030 in line system
• 4 off Quad QCR series Multi-zone forced air convection re-flow ovens.
• Ersa PL550 A  SMT & BGA Re-work station

We also have facilities to assist production volumes varying in multiple sizes, from low or single numbers, up to thousands.

Our electronics product management includes all our manufacturing services including assembly of printed circuit boards into the final product.

Electronics product management oversees the smaller, desktop instrumentation devices and hand held projects through to more complex assembly of mechanical frames, mouldings and turned parts.

We also undertake strict product testing and configuration. This benefits clients from their respective production areas and then the finished project is shipped to the customer or end user. We use flowline production and inline testing to accommodate larger volumes and also use them for lower quantities and specialised builds.

We supply an exceptional and fast rapid prototyping and initial model production service. It utilises our flexible production line, both in surface mount and conventional assembly, and can be tailored to meet most production needs.

Rapid prototyping accommodates low volume production. Manufacturing takes between three to five days and sometimes same day production can be arranged for some customers. We also have micro-packing facility is also available to provide a comparable service but incurs some constraints on material curing cycles and process times.

We provide conductive and non-conductive die bonding using epoxies and eutectic solders. We have one manual die bond and two automatic die bonding facilities available to us. They are capable of both large throughputs and tight tolerances die placements.

Our die bonding is used for various semiconductor die types including ASIC, LED, MEM, and Sensor and die bonding services are used by the industrial, medical and commercial market sectors. We are also able to diebond to a range of materials including alumina, FR4, carbon fibre, metallised ceramic, and chip on flex.

We have substantial experience in the bonding of optoelectronic die, LED arrays, thermal design and thermal management.

We supply aluminium and gold wire bonding using wedge bonding and ball bonding. We have currently invested in this area and now have two fully automatic aluminium wedge bonders and an automatic gold ball bonder.

We also have a manual heavy gauge aluminium wire bonder and when our wire bonding facilities and high precision die bonders are combined, we are able to provide our clients with products unmatched by any other independent wire bonding facility in the UK.

We offer a design for manufacture service providing complete circuit and product design facilities using CAD, PCB and Advanced Substrate Circuit Design.

All this feeds into our range of technologies including Bare Die, Thru-Hole, SMT, and Thick Film. We also have experience and specialise in the use of high brightness LEDs.

Our design for manufacture service combined with our knowledge and expertise provides clients with an exceptional facility capable of finding the correct solution for electronic circuitry in the most cost efficient and reliable way.