Gemini Tec Ltd
Deadbrook Lane
Aldershot
Hampshire
GU12 4XU ( Road Map )
Tel: 01252 333444
Fax: 01252 333474
Number of Employees: Unavailable
sales
geminitec.co.uk- Sales Director - Adam Harsant
- Business Development - David Fitzgerald
PCB Design Layout Services
- Rigid, Flex-Rigid printed circuit boards.
- Analogue, RF and high speed digital circuits.
- Impedance controlled & layer stack up.
- DDR 2, incorporating virtual via and net constraints.
- Differential/balanced pairs & bus routing.
- Altium & PADS with SPECCTRA.
- DFA - Design for assembly/manufacture, with in-house services.
- Data electronically compared to netlist prior to manufacture.
- Full manufacturing data-pack generation.
PCB & Surface Mount Assembly
At the centre of our surface mount operation is the very latest in SMT placement technology.
Our MYDATA Synergy line is equipped with two MYDATA placement machines, working in-line for high speed SMT production. This leading edge line has automatic board loading and full conveyance from pasted PCB board to oven reflow.
Using the MYDATA "Synergy" approach we can provide a flexible production service, by building SMT boards across 1 or 2 placement machines. This scalable and flexible approach allows us to build surface mount products from 1 to 10,000 pcs.
- Complex high mix PCB assembly.
- MYDATA Synergy approach for flexible production.
- Automated line, for optimum production costs.
- Jet printed solder paste, for high yield soldering.
- High technology surface mount product assembly.
- BGA, µBGA, 01005, 0201, PoP and Leadless devices.
- In-line electrical test on resistors & capacitors.
The automated Synergy line is supported by our MYDATA solder jet printer, providing pasted PCBs on demand. Only the correct amount of paste is applied to each footprint to ensure the optimum reflow conditions are achieved for high product yields. PCB assemblies are buffered and shuttled across the Synergy line conveyors within minutes of solder paste printing.
We use the latest MYDATA operational & productivity software to maximise production up time and optimise the cost of manufacture.
BGA & Leadless Device Capability
We have been manufacturing with BGA & leadless devices since the early 1990’s, and offer a full range of capabilities, to design, manufacture and re-work products. Our team of experienced technicians are able to support a range of PCB related products.
Technology tools for BGA & leadless chips include:
- X-TEK X-Ray with 3D real time inspection.
- ERSAscope optical camera inspection.
- ERSA IR650 re-work station. (Large format capability)
- BGA baking ovens & vacuum sealing.
- Re-balling (cold process)
- Thermal engineering tools and software.
- XJ-Tag testing.
- Highly experienced technicians.
Using our MYDATA Jet pasting technology and MYDATA placement technology, we can place all known devices regardless of pitch and physical size. Our skills in thermal profile management will ensure products are manufactured correctly, checked for full conformance with the ability to re-work to exacting standards.
Our expertise in technology manufacture is available to support products through the complete product life cycle.
Selective Conformal Coating for PCB assemblies
We operate a sophisticated and automated process to selectively coat PCB assemblies. Utilising our leading edge PVA coating system, we can selectively coat PCB assemblies with a wide variety of conformal coating products.
Robotic spraying allows fine amounts of coating to be selectively dispensed onto PCB's with high accuracy. Multi axis control allows the coating to sprayed on, around and underneath complex components. The distinct advantage of this technique means there is no longer a need to mask the keep out areas of the PCB. Selectively spraying allows a price point typically 20% to 30% lower than traditional coating methods.
We clean our products to exceed the guidelines of IPC CH-65 A and J-STD 001-D, also known as MIL SPEC. We use Zero Ion contamination testing to ensure the level of cleanliness prior to coating.
- Robotic and selective spraying system.
- No Masking required.
- Fine line definition.
- Spraying for accurate viscosity of coating.
- Spraying for accurate thickness of coating.
- 100% repeatable process.
- Pneumatic tilt axis for spraying underneath components.
- Full cleaning process to meet J-STD 001-D (MIL SPEC)
- Full cleaning process to meet IPC CH-65 A.
- Ultrasonic & vapour solvent cleaning.
- Ionic testing facility, with Zero Ion.
Gemini can provide its customers with fully coated PCB assemblies, as part of its turnkey operation or post test. As we use a fully automated selective process this can be supplied at cost effective rates.
PCB Manufacture
Gemini Tec has provided printed circuit boards to its customers since 1976, we are highly experienced in bare PCB printed circuit board manufacturing.
Our knowledge base and technical expertise is available to ensure core materials are manufactured to specification. Our FET team use BARCO tooling software to ensure the PCB level data passes numerous DRC & DFM checks, including verification of impedance, stack up configurations and raw material selection.
We are fully conversant with a full range of PCB technologies from standard multilayer products, HDMI products (laser via & flat pad technology) through to flex rigid products. Our experienced tooling engineers understand the necessary requirements for PCB assembly and can engineer data for optimised production techniques.
Our core competencies in PCB technology are:
- Quick turn PCB manufacture from the UK, (from 3 working days)
- Small, medium and large volume from Asia Pacific (from 5 days working days)
- High mix capability, low-to-medium volume, high technology & quick-turn.
- Multilayer technology 4-40 layers, controlled impedance, mechanical/laser drilling, LDI printing.
- Min Line width/spacing(mil): 2.5/2.5 with hole aspect ratio of up to 20:1
- PCB laminates, FR4, High Tg, HR370, IS410, P95, Rogers, Taconic, Arlon)
- Surface finishes including HASL, ENIG, ENEPIG, Immersion Silver, Immersion Tin, Flash, Gold Edge connector, OSP, Lead Free HAL.
The quality of raw PCB manufacture is critical to our assembly operation and stringent controls are in place to check PCB components such 2D mechanical inspection, FAI, micro-section, destructive testing and solder flow testing.
Our customers choose to benefit from our technical expertise and commercial leverage to provide blank PCB's, for a wide range of market leading products.
Solder Jet Printing for PCB assemblies
Gemini Tec Ltd are the first UK based CEM to introduce 'Solder Jet Printing' for high density PCB assembly.
Our MYDATA MY500 is the revolutionary SMT technology process that applies solder paste directly onto the PCB. We no longer need to use stencils for surface mount production. Over 80% of typical production errors are attributed to poor solder paste application, 'Solder Jet Printing' provides the technical solution.
Solder paste deposits are placed on demand at rate of 1.8 million dots per hour. Only the optimum amount of solder paste is applied to each pad position on the PCB, crating the ideal reflow conditions. The result ensures all the typical production errors are now removed (problems such as floating QFNs, excessive solder, short and opens etc) PCB products with surface mount products are manufactured with high yield results.
The use of 'Solder Jet Printing' has many commercial & technical advantages for Gemini Tec and its customers.
- 100% accurate and 100% repeatable, without deviation.
- No stencil tooling costs on new, repeat of modified designs.
- Optimum solder joints produced, with typical yields of 100%.
- Tooling and process development conducted in real time.
- Reduced manufacturing lead times.
- Reduced manufacturing costs.
- Suitable for complex & high density designs.
‘Solder Jet Printing’ technology is used across the entire manufacturing process at Gemini Tec. All our customers benefit from this leading edge technology regardless of the quantity we produce.
Products and Services
- Backplanes - Design
- Backplanes - Design Services
- BGA - Assembly Service
- BGA - Inspection and Re-work
- BGA - J-Tag Testing Service
- BGA - Placement
- BGA - Reballing
- BGA - Rework
- BGA - Rework, Machines
- BGA - Stencil Free Process
- BGA - X-Ray
- BGA - X-Ray Inspection and Re-balling
- CEM - (Contract Electronics Manufacture)
- CEM - Aerospace
- CEM - Industrial
- CEM - Low Volume
- CEM - Medical
- CEM - Military
- CEM - Prototype
- CEM - Scientific
- CEM - SMT
- CEM - Telecom
- CEM - Turnkey Projects
- Coatings - Conformal, Selective Method
- Component Placement - Fine Pitch
- Computer Aided Design (CAD) - Design Bureau
- Consultants - CAD, CAM
- Consultants - Turnkey Project
- Data Acquisition - DSP
- Design - Analogue Electronics
- Design - Digital Signal Processing
- Design - Electronics
- Design - Manufacture and Assembly
- Digital Signal Processing (DSP)
- Electronic Assemblies - Press-fit
- Electronic Assembly - BGA
- Electronics - Design, Assembly, Test
- Headers - Fine Pitch SMT
- Labels - RFID
- Micro BGA Placement
- Nozzles - SMT
- Offshore - PCB Assembly
- Outsource - PCB Assembly
- Ovens - SMT Reflow
- PCB - Quality, Offshore Supply
- PCB - Artwork
- PCB - Artwork Scanning Bureau
- PCB - Assemblies
- PCB - Assembly Service
- PCB - Assembly, BGA
- PCB - Assembly, Medical
- PCB - Assembly, Multilayer
- PCB - Assembly, Pick and Place
- PCB - Assembly, SMD
- PCB - Assembly, Telecom
- PCB - Assembly, Through Hole
- PCB - Automated Optical Inspection (AOI)
- PCB - Bare Boards
- PCB - Blind and Buried Via
- PCB - Broker Service
- PCB - Buying Service
- PCB - CAD Data Conversion Service
- PCB - CAD Design Bureau
- PCB - CAD Software
- PCB - Cleaning Services to J-std-001-d
- PCB - Design Services
- PCB - Design Software
- PCB - Design, Double Sided
- PCB - Design, Multilayer
- PCB - Fabrication
- PCB - Fast Turnaround
- PCB - Flexi-Rigid
- PCB - Flexi-Rigid Multi Layer
- PCB - Flexible
- PCB - Functional Test
- PCB - High Volume
- PCB - Impedance Controlled
- PCB - Importers
- PCB - Laser Drilling
- PCB - Layout Services
- PCB - Layout, Pads
- PCB - Layout, Altium
- PCB - Layout, Cadence
- PCB - Layout, Mentor
- PCB - Layout, Microvias
- PCB - Layout, Protel
- PCB - Layout, Prototype and Test
- PCB - Lead Free
- PCB - Low Volume
- PCB - Manufacture, UL Approved
- PCB - Manufacturers
- PCB - Medium, High Volume
- PCB - Metal Backed
- PCB - Metal Core
- PCB - Multilayer
- PCB - Offshore Sourcing
- PCB - One-Stop-Service
- PCB - Population
- PCB - Prototyping
- PCB - PTFE High Specification
- PCB - Purchasing
- PCB - Quick Prototype Service
- PCB - Quick Turnaround
- PCB - Rapid Prototype Manufacture
- PCB - Rapid Prototype Service
- PCB - Rework
- PCB - RF Laminates
- PCB - RF Type
- PCB - RoHS Compliant
- PCB - Single Sided
- PCB - Sub-Assemblies
- PCB - Surface Mount Assemblies
- PCB - Surface Mounted
- PCB - Testing Services
- PCB - Through Hole
- PCB - Volume Producer
- PCB Assembly
- PCB Coatings - Conformal, Selective
- Press Fit Assembly
- Printed Circuit Board Assembly - PCBA
- Printed Circuit Boards - PCB
- Printed Circuits - Design
- Prototype Design, Development, Manufacturing Service
- Rapid Prototyping Service
- Rework Equipment - IR
- RF - Design
- RF - Microwave Design
- RFID - Active Tagging
- RFID - Antennas
- RFID - Components
- RFID - CompTIA Training
- RFID - Consultancy
- RFID - Distribution
- RFID - Distributors
- RFID - Readers
- RFID - Smart Labels
- RFID - Solutions
- RFID - Terminals
- RFID - Test Equipment
- RFID - Transponders
- SMT - Adhesive
- SMT - Assembly Services
- SMT - Cleaning
- SMT - Reeling
- Smt - Solder Jet Paste Service
- SMT - Stencil Free Process
- SMT - Stencils
- SMT Connectors
- SMT Equipment
- SMT Pick and Place Systems
- SMT Placement Systems
- Stencil Free Solder Jet Paste Application
- Surface Mount Assembly Services
- Tags - RFID
- Training - RFID
- Turnkey Manufacturing Services
- Vapour Phase Reflow Process For HD PCB Assembly
Last Updated: 13-Feb-2012
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