Inseto (UK) Ltd - Wafer Probing Equipment, Die Bonding and Flip Chip System

At Inseto’s Micro Electronic Equipment and Material Division, we are world leaders in the development and manufacturing of dicing saws, wire bonders, laser scribing systems and blades used in dicing of semiconductors, wafers, glass, ceramics, ferrites and MEMS.

We are specialist suppliers of wire bonders. Our range includes:

• manual wire bonders
• automatic gold ball wire bonders
• automatic wafer bumpers  

We have comprehensive selection of plasma cleaning and etch products manufactured by Plasma Etch, inc.

From benchtop plasma cleaners, industrial plasma cleaners and etchers and inline and reel-to-reel plasma cleaners, our plasma cleaning and etch equipment can be used in a whole host of applications including:

• Surface Cleaning
• Surface Pre-treatment
• Sterilisation
• Wire Bond Cleaning
• Resist Stripping

SemiProbe is a global supplier of wafer probing equipment. Their technology is innovative, economical to build, upgrade and maintain.

Their wafer probing equipment perfect for a wide selection of applications including:

• Testing
• Bio-medical Assemblies
• Nano-electronics
• Semiconductor components

Our equipment division provides assembly, test and inspection equipment for the micro electronic, photonic, solar and semiconductor industry. They specialise in the supply of die bonding and flip chip systems.

Technical customer services are provided by highly skilled factory trained engineers who can provide a wide range of services for their die bonding and flip chip systems. Their engineers can provide application engineering, preventative maintenance and support contracts, emergency breakdown services, training courses, process assistance and development and annual calibrations.

Advanced Dicing Technologies Ltd is a leader in the design and manufacture of dicing and scribing machines. They offer dicing and scribing machines with varying capabilities and automation levels to meet a range of customer needs.

We specialise in the supply of Advance Dicing Technologies Ltd's equipment. 

We also stock a range of dicing blades and accessories to accompany their dicing and scribing machines.

We have the following products available:

• Laser Scribing Systems
• Peripheral Dicing Equipment
• Automatic Dicing Saws
• Dual Spindle Automatic Dicing Saws
• Semi-automatic Dicing Saws