At the centre of our SMT (surface mount) operation is the very latest in SMT placement technology.
Our MYDATA Synergy line is equipped with two MYDATA placement machines, working in-line for high speed SMT production. This leading edge line has automatic board loading and full conveyance from pasted PCB board to oven reflow.
Using the MYDATA "Synergy" approach we can provide a flexible production service, by building surface mount & BGA products across 1 or 2 SMT placement machines. This scalable and flexible approach allows us to build surface mount products from 1 to 10,000 pcs.
The automated Synergy line is supported by our MYDATA solder jet printer, providing pasted PCBs on demand. Only the correct amount of paste is applied to each footprint to ensure the optimum reflow conditions are achieved for high product yields. PCB assemblies are buffered and shuttled across the Synergy line conveyors within minutes of solder paste printing.
We use the latest MYDATA operational & productivity software to maximise production up time and optimise the cost of manufacture.
We have been manufacturing with BGA & leadless devices since the early 1990’s, and offer a full range of capabilities, to design, manufacture and re-work products. Our team of experienced technicians are able to support a range of PCB related products.
Technology tools for BGA & leadless chips include:
Using our MYDATA Jet pasting technology and MYDATA placement technology, we can place all known devices regardless of pitch and physical size. Our skills in thermal profile management will ensure products are manufactured correctly, checked for full conformance with the ability to re-work to exacting standards.
Our expertise in technology manufacture is available to support products through the complete product life cycle.
We operate a sophisticated and automated process to selectively coat PCB assemblies. Utilising our leading edge PVA coating system, we can selectively coat PCB assemblies with a wide variety of conformal coating products.
Robotic spraying allows fine amounts of coating to be selectively dispensed onto PCB's with high accuracy. Multi axis control allows the coating to sprayed on, around and underneath complex components. The distinct advantage of this technique means there is no longer a need to mask the keep out areas of the PCB. Selectively spraying allows a price point typically 20% to 30% lower than traditional coating methods.
We clean our products to exceed the guidelines of IPC CH-65 A and J-STD 001-D, also known as MIL SPEC. We use Zero Ion contamination testing to ensure the level of cleanliness prior to coating.
Gemini can provide its customers with fully coated PCB assemblies, as part of its turnkey operation or post test. As we use a fully automated selective process this can be supplied at cost effective rates.
Gemini Tec has provided printed circuit boards to its customers since 1978, we are highly experienced in bare PCB printed circuit board manufacturing.
Our knowledge base and technical expertise is available to ensure core materials are manufactured to specification. Our FET team use BARCO tooling software to ensure the PCB level data passes numerous DRC & DFM checks, including verification of impedance, stack up configurations and raw material selection.
We are fully conversant with a full range of PCB technologies from standard multilayer products, HDMI products (laser via & flat pad technology) through to flex rigid products. Our experienced tooling engineers understand the necessary requirements for PCB assembly and can engineer data for optimised production techniques.
Our core competencies in PCB technology are:
The quality of raw PCB manufacture is critical to our assembly operation and stringent controls are in place to check PCB components such 2D mechanical inspection, FAI, micro-section, destructive testing and solder flow testing.
Our customers choose to benefit from our technical expertise and commercial leverage to provide blank PCB's, for a wide range of market leading products.
Gemini Tec Ltd are the first UK based CEM to introduce 'Solder Jet Printing' for high density PCB assembly.
Our MYDATA MY500 is the revolutionary SMT technology process that applies solder paste directly onto the PCB. We no longer need to use stencils for surface mount production. Over 80% of typical production errors are attributed to poor solder paste application, 'Solder Jet Printing' provides the technical solution.
Solder paste deposits are placed on demand at rate of 1.8 million dots per hour. Only the optimum amount of solder paste is applied to each pad position on the PCB, creating the ideal reflow conditions. The result ensures all the typical production errors are now removed (problems such as floating QFNs, excessive solder, short and opens etc) PCB products with surface mount products are manufactured with high yield results.
The use of 'Solder Jet Printing' has many commercial & technical advantages for Gemini Tec and its customers.
‘Solder Jet Printing’ technology is used across the entire manufacturing process at Gemini Tec. All our customers benefit from this leading edge technology regardless of the quantity we produce.