Master Bond Inc

Master Bond UV15RCL is a low viscosity, cationic type UV curing system with a special color changing feature. The originally red material changes to clear once exposed to UV light, indicating that there is UV light access across the adhesive material. Although this change in color from red to clear does not indicate a full cure it does confirm that the UV light has reached the polymer. By giving immediate visual feedback UV15RCL offers processing and handling advantages over conventional systems. Curing under UV light typically takes 30-60 seconds with a broad-spectrum UV lamp emitting light with a wavelength range between 320-365 nm. The minimum energy required is 20-40 milliwatts per cm².

UV15RCL features a high glass transition temperature (T_g) of 90-95°C. However, when post cured for 1-2 hours at 125°C, the T_g can increase to 125-130°C. It has a service temperature range from -80°F to +350°F. This non-solvent based system cures tack free and has a very low viscosity of 115-350 cps, making it ideal for spin coating. It is not oxygen inhibited and provides light transmission properties and good optical clarity, with a refractive index of 1.517. Also, it is an excellent electrical insulator with a volume resistivity exceeding 10¹⁴ ohm-cm.

UV15RCL is suitable for bonding and sealing applications as it adheres well to metals, glass, ceramics and many plastics, including acrylics and polycarbonates. It is available in a wide range of packaging options, including syringes, ½ pint, pint, quart and gallon containers.

Master Bond Supreme 11AOHTMed is a two component epoxy featuring thermal conductivity and electrical insulation. This system fully passes ISO 10993-5 testing for non-cytotoxicity and is recommended for bonding and sealing in medical device applications.

Supreme 11AOHTMed has reliable electrical insulation properties with a volume resistivity exceeding 10¹⁴ ohm-cm at 75°F. It also exhibits thermal conductivity of around 4 to 5 BTU·in/ft²·hr·°F (0.58-0.72 W/m/K). The system provides high bond strength properties with a lap shear strength of 3,200-3,400 psi, a tensile strength of 7,000-8,000 psi and a compressive strength of 20,000-22,000 psi. This toughened formulation is designed to withstand thermal cycling and offers a wide service temperature range from -112°F to +400°F (-80°C to 204°C).

Supreme 11AOHTMed cures at room temperature in 24-36 hours, and faster with heat, in 1-2 hours at 200°F. To optimize properties, the recommended cure schedule is overnight at room temperature, followed by a post cure at 120-150°F for 2-3 hours or preferably longer. It bonds well to a wide variety of substrates including metals, ceramics, glass, rubbers, and many plastics. This epoxy system has a convenient 1:1 mix ratio by weight, with the mixed material being a thixotropic paste. To eliminate the need for manual measuring and mixing, it can be packaged in double barrel cartridges for gun kits. It is also available in standard jars and cans, ranging in size from ½ pint to gallon containers.

EP42HT-2FG Black is a two part, moderate heat cured epoxy with high temperature resistance that complies with FDA 21 CFR 175.105 for indirect food contact applications. The epoxy withstands exposure to a wide range of harsh chemicals, including acids, bases, and solvents. It possesses good flow properties and can be employed for bonding, sealing, potting, and casting.

This compound has a relatively long working life of 105-150 minutes for 100 grams of the mixed material at 75°F. The color of Part A is black, and Part B is light amber, with a mix ratio of 100 to 30 by weight. EP42HT-2FG Black cures optically opaque, and the recommended cure schedule is overnight at room temperature, followed by a heat cure at 150-250°F for 3 to 4 hours.

This thermally stable system offers a glass transition temperature of 145-150°C and is serviceable over a wide temperature range from -60°F to 450°F. It has a high tensile strength of 11,000-12,000 psi at room temperature and a tensile modulus of 400,000-450,000 psi. It is electrically insulative with a volume resistivity greater than 10¹⁴ ohm-cm and a dielectric constant of 4.6 at 60 Hz, at room temperature. These attributes make EP42HT-2FG Black suitable for potting and encapsulation type applications.

The system is recommended for indirect food applications particularly where the surrounding environment may be exposed to aggressive chemical washdowns or antibacterial agents. It is available in 1/2 pint, pint, quart, and gallon kits. Specialty packaging is also available in premixed and frozen syringes.

Master Bond UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms. It cures readily within 20-30 seconds when exposed to a UV light source emitting a wavelength of 320-365 nm. The adhesive can also undergo a secondary heat curing for shadowed areas, typically curing in 60-90 minutes at 80-85°C. The system's adaptability to varying depths and applications, such as encapsulation and bonding, enhances its versatility.

UV23FLDC-80TK has a viscosity of 25,000-50,000 cps, and is highly thixotropic, which is advantageous for applications where minimal flow is required. It has a low tensile modulus of 250-500 psi, and a high elongation of 90-100% at room temperature. Its toughness and flexibility allow it to withstand rigorous thermal cycling, making it well-suited for applications where low stress is critical. The system features excellent electrical insulation with a volume resistivity exceeding 10¹⁴ ohm-cm.

UV23FLDC-80TK is not susceptible to oxygen inhibition. It bonds well to metals, glass, ceramics and many plastics, including but not limited to acrylics and polycarbonates. It has a service temperature ranging from -80°F to +300°F. It is available in a wide range of packaging options, including syringes, ½ pint, pint, quart and gallon containers.

Product: MasterSil 711Med      Release Date: 11/01/2023

Designed for medical device manufacturing, MasterSil 711Med passes ISO 10993-5 testing. It is a one part, flowable, room temperature vulcanizing (RTV) silicone which needs no mixing, and can be used for bonding, sealing, coating and form-in-place gasketing applications. This non-corrosive, translucent compound withstands many sterilization methods, including liquid sterilants, gamma radiation and EtO.

MasterSil 711Med cures very quickly upon exposure to humidity or moisture. Curing speed is influenced by the humidity level, with higher humidity in the applied areas resulting in a faster cure. Additionally, thinner sections cure more quickly than thicker ones. Tack-free time at 75°F and over 50% humidity is 2-5 minutes. Once cured, it delivers high temperature resistance up to 400°F. This compound is electrically insulative, with a volume resistivity greater than 10¹⁴ ohm-cm at room temperature. Featuring superior flexibility, it is able to withstand thermal cycling, vibration and shock, with an elongation measuring between 300-400%. Its Shore A hardness is 25-35.

MasterSil 711Med bonds well to a variety of substrates including metals, glass, ceramics, many plastics and cured silicone rubber. It is packaged in 30 cc syringes, which are equally convenient for automated and manual dispensing.

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Product: Supreme 17HTND-2      Release Date: 10/12/2023

Master Bond Supreme 17HTND-2 is a toughened epoxy system for bonding and sealing applications. It is a true one component system, not premixed and frozen, with an unlimited working life at room temperature. Supreme 17HTND-2 is thermally stable, featuring a high glass transition temperature (T_g) of 410°F (210°C). It also meets NASA low outgassing specifications per ASTM E595 testing.

Supreme 17HTND-2 has reliable electrical insulation properties with a volume resistivity exceeding 10¹⁵ ohm-cm at 75°F. It possesses high bond strength properties with a lap shear strength of 1,900-2,100 psi and a tensile strength of 7,000-8,000 psi. It is designed to withstand thermal cycling and offers a wide service temperature range from -100°F to +550°F (-73°C to 288°C). Along with its simple handling properties, it has a paste consistency and is completely non-drip, making it ideal for applications where no flow is critical.

Supreme 17HTND-2 cures at elevated temperatures with cure schedule options including 300°F for 4-6 hours or 350°F for 2-4 hours. An optimal cure schedule is at 300°F for 4-6 hours, followed by a post cure at 350°F for 8-12 hours. It bonds well to a wide variety of substrates including metal, ceramics, composites and several plastics. Black in color, it is available in standard packaging of jars and cans, ranging from ½ pint to gallon containers.

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Master Bond EP21LVFL combines good flexibility with a solid strength profile. It is curable at room temperature with a long working life of 120-160 minutes at 75°F for a 100 gram batch and features a flowable initial mixed viscosity of 10,000-14,000 cps. This epoxy generates low exotherm making it suitable not only for bonding and coating, but also for sealing and potting applications.

EP21LVFL is especially useful in bonding substrates with different coefficients of expansion such as metals, composites, glass, ceramics, rubbers and plastics. It has a high elongation of 120-150%, a low tensile modulus of 1,500-2,500 psi and a shore D hardness of 40-50. The product offers excellent electrical insulation properties with a volume resistivity exceeding 10¹⁵ ohm-cm and a dielectric constant of 2.95 at 60 Hz. EP21LVFL has a tensile strength of 1,200-1,400 psi and a lap shear strength measuring 900-1,100 psi, which is impressive for a flexible product. The system is capable of withstanding rigorous thermal cycling, vibration, mechanical stress and shock.

This two part epoxy offers a non-critical one to two mix ratio, by weight or volume. Part A is clear and Part B is amber clear. Additionally, it can be formulated in other colors. EP21LVFL cures more rapidly at elevated temperatures. Optimal performance properties can be achieved by curing overnight at room temperature followed by 4-6 hours at 125-150°F. The product is available in a variety of packing options, including ½ pint, pint, quart, gallon and 5 gallon kits as well as in premixed and frozen syringes and dual cartridges for gun dispensers.

Master Bond Toughened and Flexibilized Adhesive Compounds

Master Bond EP21LVFL is a flexibilized and toughened adhesive suited for bonding, sealing, coating and potting. It features high elongation, good flow and a long working life. Read more about Master Bond’s systems with these performance properties at https://www.masterbond.com/properties/flexibilized-and-toughened-adhesive-systems or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com.

Master Bond EP40TCMed is a two part, room temperature curing epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity. It is thermally conductive, electrically non-conductive and can be utilized as an adhesive or sealant in various medical and wearable device applications.

This toughened epoxy delivers an elongation of 60-70%. It has good strength properties with a tensile lap shear strength between 2,300 and 2,500 psi, a T-peel strength of 40-60 pli and a low tensile modulus of 5,000-15,000 psi at room temperature, making it ideal for applications where low stress is needed. The system’s small particle size filler allows for effective heat transfer when applied in thin layers, lowering its thermal resistance. It is also capable of withstanding exposure to EtO, radiation and several sterilants, as well as anti-microbial cleaning agents. Serviceable from -100°F to +300°F [-73°C to +149°C], EP40TCMed features reliable electrical insulation characteristics with a dielectric constant of 4.4 at 60 Hz and a volume resistivity greater than 10¹⁵ ohm-cm. Its thermal conductivity is 8-11 BTU•in/(ft²•hr•°F) [1.16-1.60 W/(m•K)].

EP40TCMed offers convenient handling with a 1:1 mix ratio by weight, and has a relatively long working life of 2-3 hours for a 100 gram batch of mixed epoxy at 75°F. After mixing, the epoxy has a moderate viscosity of 80,000-100,000 cps, which is useful for applications where some, but not too much flow is required. Upon cure, it has low shrinkage and a hardness of 70-80 Shore D. EP40TCMed comes in standard sized units of ounce jars, ½ pint, pint, quart, and gallon kits. It is also available in premixed and frozen syringes.

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Master Bond Supreme 3DM-85 is a no mix, non-solvent based, one component epoxy. This thixotropic paste material was formulated to serve as the damming compound in dam-and-fill encapsulation applications. It can also be utilized for bonding and sealing, especially where no flow is needed since the material cures in place and will not run or slump. The compound requires a relatively low heat cure of 85°C for 2-3 hours, is thermally conductive and electrically non-conductive.

“Supreme 3DM-85 is designed for heat sensitive components that cannot withstand high temperatures for curing. The fact that it is not premixed and frozen gives it an advantage in production situations where freezer storage may not be practical. Also, there are no special shipping requirements,” says Senior Product Engineer Rohit Ramnath. As a toughened system, Supreme 3DM-85 resists rigorous thermal cycling. It is a reliable electrical insulator and features a thermal conductivity of 5-10 BTU•in/ft²•hr•°F [0.72-1.44 W/(m·K)]. It plays an important role in facilitating effective heat dissipation and preventing overheating, especially in densely packed electronic assemblies. The epoxy maintains a Shore D hardness of 75-85, offers excellent damp heat resistance and has a good physical strength profile.

Supreme 3DM-85 forms strong bonds with an extensive range of substrates commonly found in electronics and semiconductors. Substrates include metals, composites, ceramics, silicon, and a wide array of plastics. As a single part system, it is easy to handle and offers unlimited working life at room temperature. It is opaque black in color and can be applied manually or automatically. Serviceable from -100°F to +350°F [-73°C to +177°C], Supreme 3DM-85 is available for use in syringes and jars.

Master Bond Adhesives for the Electronics Industry

Supreme 3DM-85 is a toughened, one part system developed as a damming compound for dam-and-fill encapsulation. It is also useful for bonding and sealing purposes, where heat curing above 200°F is not possible. Read more about Master Bond’s specialized adhesives for the assembly of electronic devices at https://www.masterbond.com/industries/adhesives-assembly-electronic-devices or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com.

Master Bond EP5LTE-100 is a one part, non-premixed and frozen epoxy with a very low coefficient of thermal expansion (CTE), high glass transition temperature (T_g), and extremely high modulus. It has a thixotropic paste consistency making it ideal for bonding, sealing and gap filling applications. These properties are especially useful for opto-electronics or applications needing high dimensional stability and good heat resistance.

EP5LTE-100 passes NASA low outgassing specifications. It provides a tensile modulus that exceeds 1 million psi at room temperature. Minimal shrinkage upon cure combined with a low CTE of 8-12 x 10^-6 in/in/°C enables precise alignment for bonding dissimilar substrates with low coefficients of thermal expansion. With a T_g between 120-125°C, and a service temperature range from -60°C to +175°C, this epoxy is effective in high temperature environments. It is a reliable electrical insulator featuring a volume resistivity of more than 10¹⁴ ohm-cm.

EP5LTE-100 bonds well to a wide variety of substrates including metals, glass, composites, ceramics and many plastics. It has good resistance to water and damp heat. The compound has an unlimited working life at room temperature and requires a heat cure at 100°C for 90-120 minutes. Optimum properties are obtained by post curing for 2-3 hours at 100-125°C. The epoxy is available in syringes, jars, and cans.

Die Attach Epoxy Featuring High Tg Meets NASA Low Outgassing Requirements

Master Bond EP17HTDA-2 is a one component epoxy that can be used for bonding, sealing and die attachment. It is not premixed and frozen, and cures with heat. This dimensionally stable system features excellent mechanical properties with both a high modulus and die shear strength. It transfers heat and resists thermo-mechanical stresses effectively.

EP17HTDA-2 has exceptional temperature resistance with a service temperature range of -80°F to +600°F [-62°C to +316°C] and a T_g of 185-190°C. This compound has a thermal conductivity of 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m·K)], a low coefficient of thermal expansion, and is also electrically insulative with a volume resistivity greater than 10¹⁵ ohm-cm. It withstands a variety of chemicals including acids, bases, salts, fuels, oils, water and many solvents.

As a one part system, EP17HTDA-2 does not require any mixing and is curable in the temperature range of 300-350°F for around 4-5 hours. To optimize properties, a post cure of 2-3 hours at 400°F is recommended. It bonds well to a wide variety of substrates, such as metals, ceramics, plastics and composites. Upon curing, it delivers a tensile modulus exceeding 1,100,000 psi and a die shear strength of 20-23 kg-f at room temperature (2 x 2 mm [80 x 80 mil]). It also has minimal shrinkage upon curing.

While EP17HTDA-2 is well suited for electronic and related applications, it can also be used in vacuum situations as it passes NASA low outgassing testing. It is a thixotropic paste, yet is available in 10 cc and 30 cc syringes for automated dispensing, and has a shelf life of 3-6 months when stored at 40-50°F.

Master Bond Die Attach Adhesives

Master Bond EP17HTDA-2 is a one part epoxy system for die attach, bonding and sealing applications that features high temperature resistance, thermal conductivity, electrical insulation and NASA low outgassing approval. Read more about Master Bond’s die attach adhesives at https://www.masterbond.com/industries/die-attach-epoxy-adhesives or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com.

Master Bond LED415DC90 is a one component adhesive system that cures rapidly upon exposure to a 405 nm wavelength LED light source without any oxygen inhibition. The rate of cure depends upon the intensity of the light source, the thickness of the adhesive layer and the distance from the light to the adhesive. This no-mix system requires a post cure with heat, and adheres well to both similar and dissimilar substrates.

“Conventional light curing adhesives do not allow light penetration beyond 1 mm. LED415DC90’s key distinguishing factor is its ability to partially cure or fixture up to 6 mm deep or in cross sections under LED light at the right intensity,” says Rohit Ramnath, Senior Product Engineer. “That enables a unique practical feature of this product: fixturing of components which are opaque. The mechanism in which this occurs is by allowing the light to penetrate through the adhesive from the sides and not needing light to be exposed throughout the entire areas. It must be noted that post curing with heat at about 95°C for 30-60 minutes is critical for enhancing strength and overall performance.”

LED415DC90 has a thixotropic index of 5.53 at room temperature. It has a good physical strength profile with a tensile strength of 5,500-6,500 psi, a tensile modulus of 450,000-550,000 psi, and lap shear strength for Aluminum to Aluminum of more than 1,000 psi. This rigid system cures with a hardness of around 85-90 Shore D and elongation of 1-3% at 75°F. Serviceable from -80°F to +350°F, it is electrically non-conductive with a volume resistivity greater than 10¹⁴ ohm-cm. It is available in EFD® syringes, ½ pint, pint and quart containers.

Master Bond Dual Curing Adhesives

Master Bond LED415DC90 is a single component adhesive that utilizes both LED light and heat for curing and is ideal for applications where ultra-fast fixturing is critical. It is thixotropic, high strength, and electrically insulative. Read more about Master Bond’s dual curing adhesives at https://www.masterbond.com/products/dual-curing-adhesive-systems or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com.

Master Bond EP41S-5Med is a two part epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity and can be used for bonding, sealing, and coating in medical devices. It features high temperature resistance and good strength properties. As an electrically insulative material, it can be utilized in medical electronic applications.

This epoxy was tested against many sterilization methods, such as autoclaving, STERRAD®, Cidex® and Steris®, successfully resisting a hundred cycles. It is also capable of withstanding exposure to gamma radiation, ethylene oxide, as well as other aggressive sterilants and chemicals. EP41S-5Med provides a tensile strength of 10,000-12,000 psi and adheres well to a variety of similar and dissimilar substrates, including metals, plastics, rubbers, ceramics, and composites. This compound has a glass transition temperature of 140-145°C and is serviceable from -80°F to +450°F [-62°C to +232°C]. EP41S-5Med features reliable electrical insulation characteristics with a dielectric constant of 3.5 at 60 Hz and a volume resistivity greater than 10¹⁴ ohm-cm.

The system is black in color and contains no solvents or diluents. EP41S-5Med offers convenient handling with a 100 to 25 mix ratio by weight. The mixed epoxy has good flow properties with a moderate viscosity of 25,000-30,000 cps. Upon cure, it offers low shrinkage and a hardness of 85-95 Shore D. EP41S-5Med comes in standard sized units of ½ pint, pint, quart, and gallon kits. It is also compatible with automated gun dispensing systems.

Master Bond Biocompatible Adhesives

Master Bond EP41S-5Med is a high temperature and chemically resistant epoxy that meets ISO 10993-5 specifications. This two part, high tensile strength system can withstand exposure to repeated autoclaving and aggressive sterilants. Read about Master Bond medical grade adhesives at https://www.masterbond.com/properties/biocompatible-adhesives or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com.

Product: Supreme 42HT-2ND Black   Release Date: 01/05/2023

Master Bond Supreme 42HT-2ND Black is a two-part, non-drip epoxy system designed for bonding, sealing and coating applications. It is capable of withstanding temperatures up to 450°F (232°C), and provides a glass transition temperature (T_g) of 130-135°C. The material meets NASA low outgassing standards and is recommended for applications that require vacuum compatibility.

Supreme 42HT-2ND Black is electrically insulative with a volume resistivity greater than 10¹⁴ ohm-cm. This compound has a Shore D Hardness of 75-85 at 75°F and withstands rigorous thermal cycling. It passed damp heat reliability testing for 1,000 hours at 85°C and 85% relative humidity. It offers a high strength profile, with a tensile strength of 9,000-10,000 psi and a tensile modulus of 300,000-350,000 psi at 75°F.

With a forgiving mix ratio of 100 to 40 by weight or 100 to 50 by volume, this paste consistency material can be easily applied with the use of a gun dispenser or spatula. It cures at ambient temperature in 2-3 days, or faster with the addition of heat. Adding heat not only speeds up the curing process but also optimizes the overall performance properties. Supreme 42HT-2ND Black is available in standard packaging, double barrel cartridges for gun kits, as well as pre-mixed and frozen syringes.

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Master Bond EP5TC-80 is a one part, NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity. It requires a cure at only 80°C for 1.5 to 2 hours. To optimize performance properties a post cure of 1-2 hours at 80°C is recommended. Featuring a thixotropic paste consistency, this compound adheres well to a variety of substrates such as metals, composites, glass, ceramics, and many plastics. It is formulated for bonding, sealing and small encapsulating applications.

EP5TC-80 is electrically insulating, with a volume resistivity greater than 10¹⁴ ohm-cm. It features a low thermal resistance of 6-10 x 10^-6 K·m²/W and can be applied in very thin sections due to its ultra-fine particle filler. This high strength system has a tensile modulus exceeding 1.5 million psi, and a compressive strength ranging between 25,000 and 27,000 psi.

EP5TC-80 exhibits good dimensional stability with a low shrinkage upon cure, a Shore D hardness of 90-100, and an elongation of 0.5 to 1.5%. It is serviceable over the temperature range of -50°C to +150°C and has a glass transition temperature of 110-115°C. Packaging is available in 3 cc, 5 cc, 10 cc and 30 cc syringes and ships in dry ice.

Master Bond Thermally Conductive Epoxy Systems

Master Bond EP5TC-80 is a thermally conductive, electrically insulating, one part epoxy system for bonding, sealing and small encapsulating applications. It meets NASA low outgassing requirements. Read more about Master Bond’s thermally conductive adhesives at https://www.masterbond.com/properties/thermally-conductive-epoxy-adhesives or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com.

Master Bond MasterSil 323AO-LO is a two component silicone elastomer with a self-priming feature, designed for bonding, sealing and gap filling applications. This electrically insulating and thermally conductive compound meets NASA low outgassing specifications and can be used in the aerospace, electronic, opto-electronic and specialty OEM industries.

This system has a thermal conductivity of 1.15-1.30 W/(m•K). It is highly flexible with a low tensile modulus of 500-700 psi, an elongation of 50-60%, and a hardness of 70-75 Shore A. This combination of properties enables it to withstand aggressive thermal cycling and mechanical shock. MasterSil 323AO-LO has a relatively high strength profile for a silicone with a tensile lap shear strength of 250-350 psi at room temperature. It bonds well to a wide variety of substrates, including metals, composites, glass, ceramics, plastics, and other silicones without imparting residual stress when heat cured. Serviceability is from -65°F to +400°F [-54°C to +204°C].

MasterSil 323AO-LO features a paste-like consistency, which allows it to also be used as a gap filling material where minimum flow after application is desired. This formulation offers a variety of cure schedule options, with the optimum being overnight at room temperature followed by 3-5 hours at 125-175°F. It does not require exposure to air for complete cross-linking. MasterSil 323AO-LO has an easy to use 1:1 mix ratio and is available for purchase in standard containers or gun applicator kits making it convenient for manual or automated dispensing.

Master Bond EP4CL-80Med is a one part, optically clear epoxy developed for use in medical device assembly applications. It withstands repeated sterilization cycles and passes ISO 10993-5 testing for non-cytotoxicity. This product cures at moderate temperatures of around 80-85°C within 60 to 90 minutes and faster at slightly higher temperatures. As a one part, non-premixed and frozen system, it contains no solvents, and has an “unlimited” working life at room temperature. Suitable for bonding, sealing, impregnating, and coating, it provides a high glass transition temperature of 155-160°C and has an extremely low viscosity of 50-150 cps at 25°C. This allows it to be applied by brushing, spraying, and spin coating.

EP4CL-80Med provides notable strength properties including a compressive strength of 12,000-14,000 psi and a high tensile modulus of 450,000-500,000 psi at room temperature. It is serviceable over the temperature range of -62°C to +232°C. This compound is an excellent electrical insulator with a volume resistivity of more than 10¹⁴ ohm-cm at room temperature and has a refractive index of 1.52 at 25°C. EP4CL-80Med has good resistance to many sterilization methods, including autoclaving, dry heat, radiation, and chemical sterilants. Furthermore, it resists vaporized hydrogen peroxide, a sterilization technology from STERIS®. It bonds well to a variety of substrates such as metals, composites, ceramics, and many plastics. Packaging is available in jars and cans, as well as syringes.

Master Bond Sterilization Resistant Epoxies

Master Bond EP4CL-80Med is a one part epoxy for bonding, sealing and coating that passes ISO 10993-5 and withstands many types of sterilization. It can cure at temperatures as low as 80°C unlike conventional one part, heat curing systems. Read more about Master Bond’s sterilization resistant epoxy adhesives at https://www.masterbond.com/properties/sterilization-resistant-adhesives or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com.

Master Bond EP40ND is a two component epoxy system, designed for bonding, sealing and coating applications. It is a non-drip, toughened system with an easy to use 1:1 mix ratio by weight or volume. EP40ND meets NASA low outgassing specifications and has a high elongation of 80-90% at 75°F. It adheres well to many plastics, such as polycarbonates and acrylics, making it appropriate for applications that use substrates prone to stress cracking.

This flexible system provides a low tensile modulus of 1,000-1,500 psi, and a relatively high lap shear strength of 1,600-1,800 psi. EP40ND has a Shore D Hardness measuring between 50-60 at 75°F. Serviceable from -100°F to +250°F, this electrically insulative compound can withstand rigorous thermal cycling, vibration, impact and shock.

EP40ND cures within 2-3 days at room temperature, or faster with the addition of heat. The viscosity of Part A is 50,000-100,000 cps, Part B is a thixotropic paste. It has a long working life after mixing. In addition to plastics, this epoxy adheres well to a variety of dissimilar substrates such as metals, composites, glass, and ceramics. EP40ND can be used in aerospace, semiconductor, electronic, opto-electronic and medical device industries. It is available in standard packaging, as well as premixed and frozen syringes. It is also available in double barrel cartridges for use with a gun dispenser.

Master Bond EP17TF is a one part epoxy with a paste consistency, that can be readily dispensed evenly and uniformly. It has a moderately high glass transition temperature (T_g) of 150-155°C and a wide service temperature range from -150°F to +550°F. Designed to compensate for thermal mismatches, this compound resists impact, vibration, shock and rigorous thermal cycling.

EP17TF is a reliable electrical insulator, possessing a volume resistivity greater than 10¹⁵ ohm-cm and a dielectric constant of 4.5 at 60 Hz at room temperature. It maintains its electrical insulation properties, even at higher temperatures. The system has good toughness with an elongation of 5-10%. EP17TF exhibits superior strength properties, bonding well to similar and dissimilar substrates such as metal, ceramics, plastics and composites. It offers a high lap shear strength of 3,200-3,400 psi, a tensile strength of 8,000-9,000 psi and a tensile modulus of 350,000-400,000 psi at 75°F.

EP17TF requires an elevated temperature cure of 300°F for 5-6 hours, followed by a post cure at 350°F for 4-5 hours. The additional post cure is recommended to achieve optimal strength, chemical resistance and thermal properties. EP17TF withstands many chemicals, including acids, bases, fuels, oils and many solvents. It is available in standard packaging from ½ pint containers up to 5 gallon pails. Containers should be refrigerated to extend shelf life.

Master Bond High Strength, Thermal Cycling Resistant Systems

Master Bond EP17TF is a one part epoxy system with a paste consistency for applications where high bond strength and thermal cycling resistance are needed. Read more about Master Bond’s adhesives featuring thermal cycling resistance at https://www.masterbond.com/properties/thermal-cycling-resistant-adhesives or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com.

Biocompatible UV Curable Adhesive Formulated for TPU Bonding

Master Bond UV17Med is a one part, no mix, UV curable system. It was specially formulated to provide excellent adhesion to many TPUs (thermoplastic polyurethanes), which are widely recognized as challenging substrates for bonding. This compound provides very good toughness with a high elongation of 50-60%. UV17Med passes stringent ISO10993-5 cytotoxicity standards.

UV17Med cures in 10-30 seconds when exposed to a UV light source emitting at a wavelength of 320-365 nm with an energy output of 20-40 milliwatts/cm². It is recommended that one of the surfaces to be bonded is transparent, without UV blocking agents, so as to allow the light to penetrate the substrate’s surface with no shadows. This flowable system features a low viscosity of 500-3,000 cps, a tensile modulus measuring between 30,000-50,000 psi, and a service temperature range from -80°F to 250°F.

This non-cytotoxic system is formulated for demanding applications in the medical industry, and is capable of withstanding many chemicals including liquid sterilants, antimicrobial agents, Ethylene Oxide (EtO), e-beam, and gamma radiation. In addition to TPUs, UV17Med bonds well to metals, glass, ceramics and many plastics. It is available in a wide range of packaging options, including ½ pint, pint, quart, gallon and 5 gallon containers. It can also be purchased in convenient syringe applicators for automated dispensing.

Master Bond MasterSil 323 is a two component, addition cured system for bonding, sealing and potting applications. This product has a convenient to use 1:1 mix ratio, and can be packaged in double barrel cartridges for dispensing from a gun applicator. It can be applied in thin and thick sections. This silicone has excellent flexibility, with an elongation of 150-250% at room temperature, a Shore A hardness of 35-45 and a low tensile modulus of 100-175 psi at 75°F for stress relief. It is capable of withstanding rigorous thermal cycling and shock without cracking or exerting stress on components. Additionally, MasterSil 323 has a low dielectric constant of 2.8 at 75°F, 1 MHz.

“MasterSil 323 is a specialty compound which not only offers strain relief upon cure, but also provides decent bond strength to a variety of substrates, especially considering that it is a silicone,” says Senior Product Engineer Rohit Ramnath. “The lap shear strength for an aluminum to aluminum bond joint is around 200-250 psi at 75°F. Moreover, MasterSil 323 is optically clear in thinner sections and has a refractive index of 1.44 at 589 nm. It has a wide service temperature range of -65°F to 400°F.”

The optimal cure schedule for MasterSil 323 is overnight at room temperature followed by 2-4 hours at 135-165°F. The material will fully cure without exposure to air or humidity. The working life of a mixed 100 gram batch is approximately 2-3 hours. It also has extremely low shrinkage upon curing. MasterSil 323 is available for use in ½ pint, pint, quart, gallon kit containers, 30 cc syringe kits, and 50 cc double barrel cartridges for gun dispensers. Shelf life in original, unopened containers at 75°F is 6 months.

Master Bond Silicone Adhesive Systems

Master Bond MasterSil 323 is a high temperature resistant, two component silicone that features electrical insulation properties, flowability, and low stress. This system also provides decent optical clarity and good physical strength properties. Read more about our flexible silicone formulations that relieve thermally induced stress at https://www.masterbond.com/products/silicone-systems or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com.

Master Bond EP4G-80Med is a one part epoxy designed for use in the assembly of medical devices. This system is formulated with a non-metallic, graphite filler, which leads to good thermal and electrical conductivity. It possesses a thermal conductivity of 1.44-1.73 W/(m•K) and a volume resistivity of 50-100 ohm-cm. Furthermore, it complies with the ISO 10993-5 guidelines and is considered to be non-cytotoxic.

EP4G-80Med bonds well to a variety of substrates including metals, glass, ceramics, rubbers and many plastics. It is very effective as an EMI/RFI shielding compound and can also be used for static dissipation purposes. This system does not need high heat to cure; it cures readily in 60-90 minutes at 80°C. Post curing for 1-2 hours at 80°C is commonly recommended as it will optimize the overall properties of the epoxy. Its curing profile makes it suitable for many applications involving heat sensitive substrates. “The product’s unique feature is that despite incorporating a graphite based filler material it actually exhibits an excellent flow profile, especially for an electrically conductive system, with a viscosity of 4,000-10,000 cps. It also provides a low coefficient of thermal expansion of around 15-20 ppm/C at room temperature”, says Rohit Ramnath, Senior Product Engineer.

EP4G-80Med is a dimensionally stable epoxy that offers a tensile strength of 2,000-3,000 psi, a tensile modulus exceeding 750,000 psi and a Shore D hardness of 75-85 at 75°F. This system has a high glass transition temperature of 130-140°C and is serviceable over the temperature range of -50°C to +175°C. It can withstand exposure to water, antimicrobial agents and many chemical sterilants. EP4G-80Med has a relatively long working life of 8-12 hours and must be refrigerated or frozen for storage. This black in color product is packaged in 10cc and 30 cc syringes, which are shipped in dry ice. After thawing it is easy to apply. EP4G-80Med does not contain any solvents and is RoHS compliant.

Master Bond Graphite Filled Adhesive Systems

Master Bond EP4G-80Med is a one component, graphite filled epoxy that passes ISO 10993-5 specifications for cytotoxicity and is suitable for a variety of medical device applications. It features electrical and thermal conductivity and can be cured at a low temperature of 80°C. Read more about Master Bond’s graphite filled adhesives at https://www.masterbond.com/properties/graphite-filled-electrically-conductive-adhesives or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com.

Master Bond EP35AOLV is a two part heat cured epoxy system, designed for bonding, sealing, coating and potting applications. It is a thermally conductive, electrically insulating compound that withstands aggressive chemicals, such as those found in downhole oil and gas processing. EP35AOLV exhibits superior protection against corrosion in various harsh environments and helps prolong longevity of critical equipment. With a service range that extends from -60°F to 500°F (52°C to 260°C) and a glass transition temperature of around 165-170°C, it is resistant to high temperatures.

The thermal conductivity value for EP35AOLV is 7-8 BTU•in/(ft² •hr•°F) [1-1.15 W/(m•K)], and its compressive strength measures 24,000-26,000 psi. It is a filled system that has good dimensional stability and low shrinkage upon curing. “EP35AOLV has been designed not only to handle aggressive chemicals, but also to resist high temperature and high pressure environments. Additionally, it has an extremely high tensile modulus of more than 1,000,000 psi at 75°F”, says Rohit Ramnath, Senior Product Engineer.

The ideal cure schedule is 2 to 3 hours at 300°F, followed by 3 to 4 hours at 300-350°F. EP35AOLV has a forgiving 100 to 50 mix ratio by weight, and is flowable, with a mixed viscosity of 50,000-90,000 cps. It adheres well to a wide variety of substrates such as metals, composites, glass, and high temperature plastics such as PEEK. EP35AOLV is available in standard packaging from ounce kits to gallon kits.

Master Bond Chemically Resistant Adhesives

Master Bond EP35AOLV is a two part heat cured epoxy system used for bonding, sealing and encapsulating. It is able to transfer heat and is electrically non-conductive. It withstands aggressive chemicals and high temperatures, such as those found in downhole and other harsh environments. Read more about Master Bond’s chemically resistant adhesives at https://www.masterbond.com/properties/chemical-resistance or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com.

Master Bond EP21AC is a two part epoxy with a non-halogenated filler that is formulated for applications where arc resistance and flame retardancy are required. Electrical arcing is a challenge for numerous electronic or electrical devices; this occurs when electricity jumps from one connection to another, resulting in an electrical breakdown. The air surrounding the current becomes ionized and arcs, which may lead to combustion and fire. EP21AC is designed primarily with the aim to prevent arcing related issues.

“EP21AC withstood over 150 arcs without igniting and therefore was assigned the highest PLC (Performance Level Category) of 0 under the UL746A High Amp Arc Ignition test,” says Rohit Ramnath, Senior Product Engineer. “The compound is also flame retardant, as per the UL94HB standard for flammability testing. This combination of unique performance properties makes EP21AC suitable for encapsulating, potting or coating in many demanding applications.” The system is toughened, with an elongation of 10 to 20%, and is capable of resisting thermo-mechanical stresses. It is an excellent electrical insulator with a volume resistivity greater than 10¹⁴ ohm-cm, and a dielectric constant of 4.7 at 75°F. Other noteworthy properties include a tensile strength of 5,000-6,000 psi, and a tensile modulus of 300,000-350,000 psi at 75°F. It is serviceable over the temperature range of -60°C to +90°C [-75°F to +194°F].

EP21AC has a convenient to use 1 to 1 mix ratio by weight and cures at room temperature, or more rapidly with heat. It has good flow properties with a mixed viscosity of 30,000-50,000 cps, and a relatively long working life of 75-120 minutes at room temperature. This compound bonds well to a variety of substrates including metals, ceramics, composites and many plastics and rubbers. It is available for use in ounce kits, ½ pint, pint, quart and gallon container kits. Specialty packaging is also available in premixed and frozen syringes.

Master Bond EP4S-80 is a one component silver filled epoxy which meets NASA low outgassing requirements. It has an unlimited working life at room temperature and a moderate heat cure requirement of 80°C. With a viscosity of 10,000-15,000 cps, EP4S-80 has a smooth flow and is easily brushable, making it ideal for EMI/RFI shielding and static dissipation. This formulation can also be used in a variety of applications where electrical conductivity is required: bonding, sealing, coating, as well as gap filling and encapsulating.

EP4S-80 features excellent mechanical properties with a tensile modulus of 500,000-600,000 psi and a compressive strength of 22,000-24,000 psi at 25°C. This electrically conductive system offers a volume resistivity of 0.02-0.06 ohm-cm and a thermal conductivity of 1.30-1.44 W/(m•K). Upon curing, EP4S-80 offers low shrinkage, excellent dimensional stability and a glass transition temperature of 130-135°C. Serviceable over the temperature range of -60°C to +150°C [-75°F to +300°F], this compound adheres well to a variety of substrates such as metals, composites, glass, ceramics, semiconductor materials and many plastics. It is packaged in ounce and pound jars.