A-Gas Electronic Materials

We are the sole UK and Eire distributors for Dow Electronic Materials, Micro Chem Corporation, Pavco, Micro Resist Technology, Electra Polymers, Trimite, KMG Ultra Pure Chemicals, Hendor PE, Yamamoto-MS, Metalor, Eternal Materials Co Ltd and Micropulse Plating Concepts (MPC).

The major markets we serve are  Semiconductor, Printed Circuit Board, Electronic Finishes, General Metal Finishing and Photovoltaics. 

We also offer competitive rates for chemical warehousing and technical consultancy/R&D.

We can also offer a complete range of solvents, acids and specialist etchants manufactured in the UK.

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  2. Industrial Cleaning Chemicals
  1. ACCELERATOR™ PM-960

    ACCELERATOR™ PM-960
    Acid solution that modifies absorbed catalyst particles
  2. ACCELERATOR™ PM-964

    ACCELERATOR™ PM-964
    ACCELERATOR™ PM-964
  3. ACID CLEANER™ HVP637

    ACID CLEANER™ HVP637
    Complexor-free acid cleaner for the cleaning and deoxidation of copper
  4. ACID CLEANER™ PC

    ACID CLEANER™ PC
    Acid cleaner for resist-coated printed circuit boards
  5. Acids and Bases

    Acids and Bases
    KMG Electronic Chemicals offers the broadest line of semiconductor-grade wet chemicals in North America. We also supply major technology customers in Europe, the Middle East and Asia. With purities that extend to the parts-per-trillon (ppt) level, our high-quality acids and bases are used for cleaning formulations and other processes by semiconductor and wafer fabs throughout the world.
  6. ACTRONAL™ 440

    ACTRONAL™ 440
    Acidic descaler for removing oxides and heat scale from copper- and iron-based alloys
  7. ACTRONAL™ 440 (II)

    ACTRONAL™ 440 (II)
    Acidic descaler designed for the removal of oxides and heat scale from iron/nickel based alloys
  8. ACTRONAL™ 550

    ACTRONAL™ 550
    Acidic descaler designed for removing oxides and heat scale from copper- and iron-based alloys
  9. ACTRONAL™ 988

    ACTRONAL™ 988
    Acidic descaler designed for the removal of oxides and heat scale from copper-based alloys
  10. Advanced Chip Packaging

    Advanced Chip Packaging
    Dow's advanced semiconductor packaging solutions offer a comprehensive portfolio of metallization, lithography and dielectric materials. Featured products include its bump-plating chemistries, copper for wafer level packaging, packaging photoresists, photosensitive and dry-etch dielectric materials as well as under-bump metallization materialsBelow is Dow's product selection guide for this business group.