Hybrid Laser Technology Ltd


Hybrid Laser Tech has been manufacturing and supplying precision laser cut ceramic substrates to the micro-electronics industry for over 20 years.

During this time we have pioneered a robust and repeatable process for cutting a range of ceramic substrates that allows us to deliver one of the best cut qualities currently available in the industry.

In 2005, Hybrid Laser Tech was acquired by award-winning manufacturing company, Shearline. Located in Cambridgeshire, UK (an internationally recognised centre of innovation), Shearline has been trading for over 30 years and is one of the UK’s most successful engineering companies.

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Laser Cutting / Profiling

Laser machining is the process of cutting and profiling a range of materials by vaporizing the portion encountered in the very small, well defined laser path. Unlike conventional machining methods, precision laser cutting is used to achieve complex cut patterns and because there is no part contact, material distortion is reduced to a minimum.

Laser cutting is often used on materials such as ceramics, metals and plastics. It is also being used in more delicate applications using materials such as wood, paper and acrylics.

Laser Cutting / Profiling


Laser scribing is used to etch lines into a material. The most common application is to create ‘snapstrates’ by perforating a substrate into multiple segments so it can be snapped into individual small substrates.

Click here to view our mechanical tolerances for scribing.



Laser drilling is the process of creating a ‘thru-hole’ by pulsing laser energy at a focused area. The process is incredibly fast and precise, with thru-holes produced in milliseconds with little or no debris.

Laser hole drilling of materials such as ceramics, alumina and ALN offer high-accuracy and repeatability favoured by the medical device industry, semiconductor manufacturing and nanotechnology support systems.



The precise, repeatable nature of lasers make them perfect for engraving and marking in fine detail on smaller components as well as the accurate removal of substrate coatings.

The laser parameters and the laser’s position can be precisely controlled to provide high contrast marks in the form of barcodes, logos and graphics.

Our lasers can be used to laser engrave a multitude of materials to high specifications. The process will enable both line widths and spacing to be produced at measurements of as little as 0.1mm.

Sequential part numbers for batch traceability can be off-line programmed for rapid processing.


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