Inseto (UK) Ltd

Our equipment division provides assembly, test and inspection equipment for the micro electronic, photonic, solar and semiconductor industry. They specialise in the supply of die bonding and flip chip systems.

Technical customer services are provided by highly skilled factory trained engineers who can provide a wide range of services for their die bonding and flip chip systems. Their engineers can provide application engineering, preventative maintenance and support contracts, emergency breakdown services, training courses, process assistance and development and annual calibrations.

Manual Wafer Probers for 100 (4"), 150 (6"), 200 (8"), 300mm (12") & 450mm (18") diameter wafers and substrates. SemiProbes low-cost manual wafer probing equipment is suitable for use in Research, Academic, University, Failure Analysis and Manufacturing locations. Their product range comprises:

Lab Assistant™ - A bench top manual probe station, with probing capabilities ranging from individual die to 200 mm wafers and substrates.
SemiProbe's Lab Assistant is a manual probe station specifically designed to address the requirements of Universities and research personnel with its ease of use, simplicity, portability, affordability and modularity.
The equipment is available for DC or HF/Microwave testing and comes with all the necessary options to start probing "Out-Of-The-Box". Numerous accessories can be added at a later date to enhance the system functionality.
Probe System For Life™ (PS4L) - The PS4L family of wafer probing systems is designed based on SemiProbe's patented adaptive architecture. Unlike traditional probe systems, all bases, stages, chucks, microscope mounts, microscope movements, optics, manipulators and more - are interchangeable.
This unique modular design enables customers to acquire test capabilities that precisely match their requirements. More important, as the environment or test conditions change, the PS4L can easily be field-upgraded to meet these new demands. With this design philosophy, PS4L customers realise substantial time and cost savings over traditional probe systems because they do not need to invest in a new platform when wafer size, levels of automation, or test requirements change.
The PS4L is available in manual to semi-automatic and fully automatic configurations, with probing capabilities ranging from individual die to >450 mm wafers/substrates.