Logitech Ltd

7 PRODUCTS/SERVICES
- EMPLOYEES
- YEAR FOUNDED

Logitech are recognised as world leaders in many aspects of materials processing, shaping and surface finishing technology.

This position has been reached through many years expertise in materials processing and in the design and manufacturing of precision equipment.

Application areas where we can provide solutions and advance processing technologies include:

  • Semiconductor materials processing
  • Opto-electronics surface finishing
  • Optical materials processing
  • Geological science thin section preparation
  • Test & measurement of materials
  • Materials processing consumables

 

Cutting Edge Materials Processing Solutions

Our core business is in the design and manufacture of precision sawing, lapping and polishing equipment.  Our equipment is aimed at applications with the need for high specification surface finishes, prepared with precise geometric accuracy.

We are unique in our approach with "system packages", enabling clients to get the best from their application processes. As part of a system package, we include a high level of technology transfer and support to provide customers with reliable systems which meet the required specifications over a long period of time.

Materials Processing Development

Our active and continuous policy of new product development and matreials process development ensures we effectively suport our clients, whilst actively developing new systems and application processes for current and future materials.

call us on +44 (0)1389 875444 or complete our contact form at http://www.logitech.uk.com/contact-us.aspx

www.logitech.uk.com

Cutting Edge Materials Processing Solutions

Our core business is in the design and manufacture of precision sawing, lapping and polishing equipment. Our equipment is aimed at applications with the need for high specification surface finishes, prepared with precise geometric accuracy. 

We enable our clients to get the best from their application processes with our unique "systems packages", which include a high level of technology transfer and support to provide customers with reliable systems which produce the highest quality results over a long period of time. 

Logitech Technologies

Akribis-air - Akribis-air is a highly automated, stand alone lapping and polishing system which provides superior results in minimal time. Akribis-air is a fully integrated system with intelligent automation features which substantially reduces user input, variability, set-up and clean up operations. Learn more here. 

CMP-Tribo - The Chemical Mechanical Polishing system Tribo offers nanometer level material removal capabilities on either individual die wafers or wafers up to 100m/4" diameter. This solution is suitable for a wide variety of wafer/substrate materials used in todays device fabrication processes. Learn more here.

 

 

Wafer Substrate Bonding Unit - The Logitech WSBU's are premium bonders for the processing of fragile semiconductor wafers such as Silicon and Gallium Arsenide. These bonding units are available as a single or triple station unit and has 100mm(4"), 150mm(6") or 300mm(12") wafer capacity. The bonders are designed to minimise breakage with these expensive materials whilst retaining the highest quality of sample yield. Learn more here. 

Consumables - Logitech also provide a wide range of precision material processing consumables for optimal performance. In-hous research and analysis provides us with the know how to achieve the best results across a wide range of materials processing applications. Logitech consumables enable you to achieve optimal performance and maximise the lifespan of your Logitech system. Visit our online shop for more information.

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