Master Bond Inc

Master Bond’s product line consists of epoxy, polyurethane, polyamide, silicone, cyanoacrylate and latex . Master Bond is a leading manufacturer of high quality adhesives, sealants, and coatings. Master Bond caters to the entire spectrum of high-tech applications, including conformal coating, potting & encapsulation, and impregnation. Master Bond’s structural adhesives offer design flexibility and provide excellent bonding performance with a vast array of 3,000 custom designed adhesive formulations.  properties differ in viscosity, cure speed, temperature and chemical resistance, strength, electrical and thermal conductivity. Specific adhesive systems can be designed to meet USP Class VI certification for medical use or NASA requirements for low outgassing. Master Bond recognizes that each application presents unique property requirements that must be met. If a compound is not available in Master Bond’s vast product line to meet those requirements, their experienced research and development team will promptly formulate one. Master Bond products are successfully implemented in medical, optical, aerospace, electronic, and other industries.

 

Nanosilica Filled, Electrically Insulative Epoxy Features Abrasion Resistance

Nanosilica Filled, Electrically Insulative Epoxy Features Abrasion Resistance

Master Bond EP21NS is a two part epoxy that may be used for bonding, coating, sealing and potting/encapsulating. It has a nanosilica filler that imparts dimensional stability and abrasion resistance. When measured according to ASTM D4060 standard test method for abrasion resistance with CS-17 wheel for 1,000 cycles, EP21NS exhibits a very low weight loss of 25 mg. This formulation is a reliable electrical insulation with a volume resistivity greater than 1015 ohm-cm, an outstanding dielectric constant of 2.8 at 16.4 GHz and a dielectric strength of 450 volts/mil at 75°F, for a 1/8th inch thick specimen. It is serviceable over the temperature range of -80°F to +250°F.

This system has a long working life and good flow properties with a moderate mixed viscosity of 50,000-90,000 cps. The mix ratio of EP21NS is 1 to 1 by weight, and its optimal cure schedule is overnight at room temperature followed by 4 to 5 hours at 150°F. It features very low shrinkage upon curing, a low coefficient of thermal expansion of 30-35 x 10-6 x in/in/°C and a compressive strength of 16,000-18,000 psi.

This compound bonds well to a variety of substrates including metals, composites, glass, ceramics, rubbers and many plastics. EP21NS is resistant to water and salts. It is packaged in ounce kits, ½ pint kits, pint kits, and quart kits. The color of Part A is translucent and Part B is amber. EP21NS does not contain solvents and is RoHS compliant.

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