Master Bond Inc

Master Bond EP30DPBFMed is a two part, flexibilized epoxy-urethane hybrid system that can be used for bonding, sealing, coating, and encapsulation. It is formulated for disposable and reusable medical devices, meeting USP Class VI requirements while also complying with RoHS3 in accordance with the EU directive 2015/863/EU. EP30DPBFMed is resistant to thermal cycling and sterilization, withstanding exposure to gamma radiation, e-beam, EtO, as well as other liquid sterilants.

Its low viscosity of 3,000 to 6,000 cps for Part A, and 200 to 500 cps for Part B, makes it readily pourable and ideal for potting and casting. EP30DPBFMed has a long working life of 60 to 90 minutes per 100 grams mass at 75°F, and features a low exotherm during the curing process. The system contains no solvents or diluents.

Due to the addition of a urethane based flexibilizer, EP30DPBFMed offers both a higher abrasion resistance and a higher elongation when compared to a typical epoxy system. At room temperature, it has an elongation at break of 20 to 40%, and Shore D hardness of 30 to 50. It is useful in applications where low stress is important, due to its low modulus value. This compound is electrically insulative with a volume resistivity greater than 10¹⁴ ohm-cm. EP30DPBFMed is serviceable over a wide temperature range from cryogenic 4K to 250°F.

This formulation is available for use in a variety of standard packaging options ranging in size from ounce kits to gallon kits. Specialty packaging in premixed & frozen syringes, and gun applicators with double barrel cartridges is also available.

Master Bond Flexibilized and Toughened Adhesives

Master Bond EP30DPBFMed is a toughened, urethane based epoxy that can be utilized in applications ranging from bonding and sealing to encapsulating and casting. Read more about Master Bond’s flexibilized and toughened systems at https://www.masterbond.com/properties/flexibilized-and-toughened-adhesive-systems or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com.

Master Bond EP62-1AO is a two part epoxy adhesive and sealant with an exceptionally long working life of 12-14 hours at ambient temperature for a 100 gram mass. This makes it beneficial when bonding and sealing large or intricate parts that may need ample time for mixing and applying. This material has a high strength profile with a tensile modulus of 600,000 to 650,000 psi and a tensile strength of 5,000 to 6,000 psi. The service temperature range is -60°F to +450°F and it offers a glass transition temperature of 120-125°C.

EP62-1AO is both electrically insulating and thermally conductive with a thermal conductivity value of 9-10 BTU•in/(ft²•hr•°F), or 1.30-1.44 W/(m•K). Its chemical resistance profile is robust, especially when compared to other thermally conductive epoxies. It can withstand a wide range of acids, bases and solvents. EP62-1AO has a low coefficient of thermal expansion of 18-21 x 10^-6 in/in/°C.

The viscosity of the mixed compound is of a thixotropic paste consistency. There are several cure schedule options to choose from, all of which require a relatively low heat activation. Additional post curing for 2 to 4 hours at 200-300°F is recommended to obtain optimal performance properties. It is available in 30 cc syringe kits, 1/2 pint kits, pint kits, and quart kits. The color of Part A is off white and Part B is dark brown.

Master Bond Epoxy Sealants

Master Bond EP62-1AO is a thermally conductive, electrically insulative two part epoxy sealant with a long working life. This material can also be used as an adhesive since it offers a high tensile strength and tensile modulus. Read more about Master Bond’s industrial sealants at https://www.masterbond.com/applications/sealing-applications or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com.

Master Bond LED405Med is a one component, LED curing adhesive system that meets ISO 10993-5 cytotoxicity requirements for use in medical device assembly. “Since this system does not need a UV light for curing it is intrinsically more user friendly”, says Rohit Ramnath, Senior Product Engineer. “LED405Med has a nanosilica filler resulting in both lower shrinkage upon cure, as well as greater dimensional stability with a coefficient of thermal expansion of 35-40 in/in x 10^-6/°C. This product cures to a hardness of 65-75 Shore D, indicating that it is not too stiff, thereby offering good toughness.”

LED405Med is optically clear, with a refractive index of 1.50, and offers excellent light transmission properties. This electrically insulative system features a high volume resistivity of more than 10¹⁴ ohm-cm and a low dielectric constant of 4.2 at 60 Hz. It has good flowability with a viscosity of 2,000-8,000 cps and can be used for bonding, sealing and coating. LED405Med cures up to 0.125 inch thick and is suitable for small encapsulations involving optical assemblies or other sensitive components.

This no-mix system cures fully tack-free upon exposure to a 405 nm wavelength light source without any oxygen inhibition. In thinner sections, full cures can be achieved in 30-45 seconds. The rate of cure depends upon the intensity of the light source, the thickness of the adhesive layer and the distance from the light to the adhesive. LED405Med is serviceable from -60°F to +250°F and withstands gamma radiation as well as various chemical sterilants including EtO.

Master Bond EP93AOFR is a two part epoxy that may be used in encapsulation and potting applications, as well as in bonding, sealing and coating. According to Rohit Ramnath, Senior Product Engineer, "This flame retardant non-halogenated system is not only thermally conductive, 9-10 BTU•in/ft²•hr•°F [1.30-1.44 W/(m•K)], but it is also a reliable electrical insulator with a volume resistivity greater than 10¹⁴ ohm-cm. EP93AOFR has an easy to use 1:1 mix ratio by weight and a good flow profile with a mixed viscosity of 30,000-150,000 cps.”

The Federal Aviation Regulations (FAR) Standard 14 CFR 25.853(a) test is typically used for determining material compatibility for various components inside aircrafts. This material has met and exceeded the requirements for the vertical ignition test where castings of the epoxy EP93AOFR were exposed to flames for 60 seconds. The results show that it took under 4 seconds to extinguish the flames, well under the allotted 15 seconds permitted by the test. The second part of this test measures how far the flame spreads. EP93AOFR exhibited a burn length of just 1.2 inches, well under the maximum allowed of 6 inches.

EP93AOFR bonds well to a variety of different substrates including metals, composites, glass, ceramic, FR4 and other plastics. It is serviceable from -80°F to +300°F [-62°C to +149°C] and offers good chemical resistance to water, fuels, oils, and many common solvents. This system is available for use in ounce, ½ pint, pint, quart and gallon kits. It can also be purchased in premixed and frozen syringes.

Master Bond Supreme 3HTS-80 is a one part, silver filled epoxy adhesive that is not premixed and frozen and features an unlimited working life at room temperature. “While typical heat activated epoxies require 250°F to 350°F to cure, Supreme 3HTS-80 cures at 175°F to 185°F within 2-3 hours” says Rohit Ramnath, Senior Product Engineer. “Curing at such temperatures makes this system advantageous for bonding applications involving heat sensitive substrates.”

Supreme 3HTS-80 has a volume resistivity of less than 0.05 ohm-cm. Upon curing, it exhibits a hardness of 50-60 Shore D and a high thermal conductivity over 20-25 BTU•in/(ft²•hr•°F) [2.9-3.6 W/(m•K)]. This 100% reactive epoxy bonds well to metals, composites, glass, ceramics, and many plastics. As a toughened system, Supreme 3HTS-80 can withstand thermal cycling and shock with a service operating temperature range from -100°F to +350°F [-73°C to +177°C].

Supreme 3HTS-80 is a thick paste with a specific gravity of 3.9 that can be readily dispensed from a syringe. Storage in a conventional refrigerator is recommended as this system does not require freezing. This compound is packaged in syringes or glass jars with common sizes including 20 grams, 50 grams, 100 grams, 1 pound and multiple pound units.

Master Bond EP30NG is a two part epoxy adhesive system developed for applications that require high thermal conductivity. It contains a specialty graphene filler which contributes not only to its high compressive strength, but also to its enhanced dimensional stability. EP30NG achieves an extraordinary thermal conductivity of 38.15 BTU•in/(ft²•hr•°F) [5.5 W/(m•K)] at room temperature while its compressive strength measures 22,000-24,000 psi upon cure. It has a low coefficient of thermal expansion of 24-26 x 10^-6 in/in/°C and exhibits a Shore D hardness of 85-95.

According to Rohit Ramnath, Senior Product Engineer, "EP30NG is ideal for bonding applications where some contact pressure can be applied. The minimum bond line thickness is 0.18mm, since graphene nanoparticles tend to agglomerate to form larger particles." This epoxy system is formulated to cure at room temperature or more rapidly at elevated temperatures. Part A has a thick paste consistency and Part B is a low viscosity liquid.

EP30NG bonds well to a variety of substrates including metals, composites, ceramics, glass and many plastics. The service temperature range is -60°F to +300°F. The product is available in 30 cc jar kits, 1/2 pint kits, and pint kits.

Master Bond UV22DC80-1Med is a single component, nanosilica filled compound featuring a UV and heat curing mechanism. Not only does it pass USP Class VI tests for biocompatibility, but it also meets ISO 10993-5 for cytotoxicity, making it ideal for many applications in the medical device industry.

As a nanosilica filled system, UV22DC80-1Med offers low shrinkage upon cure, excellent abrasion resistance and dimensional stability with a low coefficient of thermal expansion of 30-35 x 10^-6 inch/inch/°C. It is a reliable electrical insulator with volume resistivity of more than 10¹⁴ ohm-cm and dielectric constant of 3.85 at 60 Hz. UV22DC80-1Med is optically clear with a refractive index of 1.52.

The UV curing process for UV22DC80-1Med takes only 10-30 seconds at a 365nm wavelength and 10-40 mW/cm² of UV output. The heat curing process can be initiated at 80°C, making it highly desirable in applications involving heat sensitive components. Optional post curing at  125-150°C for 15 -30 minutes will increase the glass transition temperature to over 125°C. This system is not oxygen inhibited.

UV22DC80-1Med has a low viscosity of 500-3,500 cps at 75°F (~ 23°C). It bonds well to a variety of substrates including metals, glass, ceramics and most plastics. This compound has very good resistance to various sterilization methods including autoclaving and many chemical sterilants. It is available for use in 30 cc EFD syringes, ½ pint, pint, and quart containers.

Master Bond Supreme 17HT is a single component, no mix epoxy system for bonding and sealing applications featuring an unlimited working life at room temperature. “This thermally stable formulation has a high glass transition temperature of 410°F (210°C) and retains its bond strength at elevated temperatures,” says Rohit Ramnath, senior product engineer. “As a toughened system, it is ideal for bonding dissimilar substrates. Supreme 17HT’s unique combination of properties makes it suitable for applications involving repeated exposure to thermal cycling.” It also meets NASA low outgassing specifications per ASTM E595 testing.

Supreme 17HT possesses high bond strength properties with lap shear strength of 1,900-2,100 psi and tensile strength of 7,000-8,000 psi. This system is a reliable electrical insulator with volume resistivity of over 10¹⁵ ohm-cm at ambient temperatures and over 10¹² ohm-cm at 400°F. It is serviceable from -100°F to +550°F (-73°C to 288°C). Along with its simple handling properties, Supreme 17HT offers a moderate viscosity of 100,000-150,000 cps.

Supreme 17HT cures at elevated temperatures with cure schedule options including 300°F for 5-6 hours or 350°F for 4-5 hours. It is available in standard packaging ranging from ½ pint to 5 gallon containers as well as specialty packaging including cartridges and syringes.

Two component epoxy, Master Bond EP88FL, is a highly flexible, optically clear compound formulated for bonding, coating, sealing, potting and encapsulation. It is easy to use, with a mixing ratio of one to one by weight or volume.

EP88FL withstands thermal cycling and shock. It is ideal in applications where stress relief is needed with a tensile modulus ranging from 10,000 psi to 20,000 psi. This system provides an elongation of 30-50% and bonds well to a wide variety of substrates such as metals, ceramics, plastics and glass. Despite curing with a good degree of flexibility, it cannot be considered soft since it has a Shore D hardness between 45-55 at 75°F. The refractive index is 1.51 at 589 nm, making the system relevant for applications in optics, opto-electronics, aerospace and OEM.

The mixed viscosity of EP88FL is 800-1,200 cps at room temperature, and its working life is 20-30 minutes for a 100 gram batch. EP88FL can be cured at room temperature or elevated temperatures. The optimal cure is overnight at 75°F plus 1 to 2 hours at 150-200°F. Master Bond EP88FL is available in standard packaging ranging from ½ pint to 5 gallon containers as well as specialty packaging including FlexiPaks®, syringes and gun dispensers.

Featuring a combination of thermal conductivity and electrical insulation properties, Master Bond Supreme 3CCM-85 is a new single component epoxy initially designed for glob top and chip coating applications. However, this system can also be utilized for encapsulation and bonding. Supreme 3CCM-85 cures within 2-3 hours at 175-185°F [80-85°C], which is advantageous for use on heat sensitive components and substrates.

Supreme 3CCM-85 is a toughened adhesive system, that bonds well to a variety of similar and dissimilar substrates. It has a high volume resistivity of more than 10¹⁴ ohm-cm and a thermal conductivity of 5-10 BTU•in/ft²•hr•°F [0.72-1.44 W/(m•K)]. The system is serviceable from -100°F to +350°F [-73°C to +177°C].

Since Supreme 3CCM-85 is not premixed and frozen and has a very long open time at room temperature, it is more convenient to handle and store than typical two component glob top systems. This opaque black compound has a thixotropic paste-like consistency and is easy to apply either manually or with an automated dispenser. Master Bond Supreme 3CCM-85 is available for use in common size syringes ranging from 10 cc to 30 cc as well as in standard size containers.

Master Bond EP21TP-2NV is a two part epoxy polysulfide formulated for use as an adhesive, sealant and potting system. It withstands prolonged exposure to many harsh chemicals including fuels, oils, hydrocarbons and hydraulic fluids. It is also fully RoHS compliant, meeting RoHS3 Directive (EU) 2015/863.

EP21TP-2NV offers an elongation between 40-80% at room temperature and superior toughness with a tensile strength of 3,000-4,000 psi. It resists aggressive thermal cycling over the service temperature range of -80°F to +250°F [-62°C to +121°C]. With a dielectric constant of 3.7 at 60 Hz, the system provides excellent electrical insulation properties.

Master Bond EP21TP-2NV cures at room temperature in 48-72 hours to form a rigid material with a Shore D hardness measuring 60-65. A unique feature of EP21TP-2NV is its ability to cure softer with the addition of heat. For example, when cured at 200°F for 2-3 hours its hardness decreases to 15-20 Shore D.

EP21TP-2NV bonds well to a variety of substrates such as metals, glass, ceramics and many rubber and plastic materials. This compound is available in standard size containers from ½ pint, pint, quart and gallon kits as well as specialty packaging including double barrel syringes and gun dispensers.

Master Bond UV10TK40M is a one part UV curable system, which is not oxygen inhibited, and can be used for bonding, sealing and coating applications. UV10TK40M is optically clear, with a refractive index of 1.55. It has a high glass transition temperature (T_g) of 135-140°C and is serviceable from -60°F to +450°F. Its hardness upon curing is 75-85 Shore D.

“Not only does it meet NASA low outgassing specifications, but this system also withstands 1,000 hours at 85°C/85% RH. Its Shore D hardness was not adversely affected even after exposure to elevated temperatures and high relative humidity”, says Rohit Ramnath, Senior Product Engineer. UV10TK40M cures in 20-30 seconds when exposed to a UV light source emitting at a wavelength of 320-365 nm with 20-40 milliwatts per cm².

UV10TK40M bonds well to glass, surface treated metals and plastics such as polycarbonates and acrylics. UV10TK40M is recommended in fiber-optic, optical, opto-electronic and electronic applications where heat resistance and a moderate viscosity are needed. The product is available in 1/2 pints, pints, quarts, gallons and syringes.

Master Bond Supreme 112 is a new two part epoxy for bonding, sealing, potting, and impregnation applications. It is a heat curable system with a very low viscosity of 50-200 cps and a long open time of 2-3 days at room temperature for a 100 gram batch. Supreme 112 features a high glass transition temperature of 190-195°C and is serviceable up to 288°C (550°F). This compound bonds well to a variety of substrates including metals, composites, glass and ceramics. As a toughened system it withstands thermal cycling and mechanical stresses.

“Supreme 112 can be applied successfully not only in bonding applications, but it can also be used in porosity sealing. Additionally, it offers a high tensile strength of 11,000-12,000 psi”, says Rohit Ramnath, Senior Product Engineer. “This non-solvent based compound also meets NASA low outgassing requirements.”

Supreme 112 retains its electrical insulation properties even at elevated temperatures. While this system has a relatively easy to use mix ratio, 100:70 by weight, it requires a three step oven curing process of 1-2 hours at 200°F, followed by 3-4 hours at 250°F and then 4-6 hours at 300°F. Despite the long cure schedule, Supreme 112 offers a unique combination of performance properties advantageous in many applications in aerospace, electronic and automotive industries.

Master Bond Supreme 121AO is a NASA low outgassing approved epoxy suitable for bonding, sealing and potting applications. Featuring a high glass transition temperature of 200-210°C, it resists temperatures up to 550°F. This system exhibits an element of toughness, and is not as stiff as conventional epoxies that withstand extreme temperatures.

Supreme 121AO has a noteworthy strength profile with a tensile modulus of 750,000 to 850,000 psi at room temperature and a compressive strength of 26,000 to 28,000 psi. Its thermal conductivity is 4-5 BTU•in/(ft²•hr•°F), and it is also electrically non-conductive. Shrinkage upon cure is exceptionally low. This system not only withstands thermal cycling and mechanical stresses, but also resists many chemicals, including water, oils, fuels, acids and bases. Supreme 121AO may be used in aerospace, electronic, opto-electronic and OEM applications.

This two part epoxy has a mix ratio of 100 to 80 by weight. The viscosity of the mixed compound is 10,000-25,000 cps, making it readily pourable for potting and casting. It has a long working life after mixing of 2-3 days, for a 100 gram batch. The recommended cure schedule is 1-2 hours at 200°F followed by 3-4 hours at 250°F, and then 4-6 hours at 300°F. Additional post curing at 350°F for 2-4 hours will further enhance product properties.

Master Bond EP3UF-1 is a new single component epoxy that is not premixed and frozen. Due to its low viscosity of 5,000-15,000 cps, this heat curable thixotropic compound is ideal for underfill and many bonding applications. EP3UF-1 delivers high bond strength and dimensional stability with a compressive strength of 18,000-20,000 psi and a tensile modulus of 450,000-500,000 psi.

EP3UF-1 has a thermal conductivity of 9-10 BTU•in/ft²•hr•°F [1.30-1.44 W/(m•K)], making it an effective thermal interface material. It contains a special filler with a small particle size. This allows it to be applied in bond lines as thin as 10-15 microns imparting a low thermal resistance of 5-7 x 10^-6 K•m²/W. It offers superior electrical insulation with a low dielectric constant of 4.5 at 60 Hz as well as a high dielectric strength of 450 volts/mil (for 1/8” thick test specimen), both measured at 75°F.

As a single component system, EP3UF-1 is more convenient to handle, apply and store than typical two component adhesive systems. It has an unlimited working life at room temperature and cures in 20-30 minutes at 250°F, or in 10-15 minutes at 300°F. EP3UF-1 is available for use in 10 cc syringes and 30 cc syringes, which are compatible with automated dispensing systems.

Master Bond Adhesives for Electronic Applications

Well suited for underfill applications, Master Bond EP3UF-1 is a one part, low viscosity epoxy adhesive that cures rapidly at elevated temperatures. It offers thermal conductivity, electrical insulation and dimensional stability. Read more about Master Bond’s adhesives for electronics packaging and assembly at https://www.masterbond.com/industries/adhesives-assembly-electronic-devices or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com.

Master Bond LED405Med is a one component, LED curing adhesive system that meets ISO 10993-5 cytotoxicity requirements for use in medical device assembly. “Since this system does not need a UV light for curing it is intrinsically more user friendly”, says Rohit Ramnath, Senior Product Engineer. “LED405Med has a nanosilica filler resulting in both lower shrinkage upon cure, as well as greater dimensional stability with a coefficient of thermal expansion of 35-40 in/in x 10^-6/°C. This product cures to a hardness of 65-75 Shore D, indicating that it is not too stiff, thereby offering good toughness.”

LED405Med is optically clear, with a refractive index of 1.50, and offers excellent light transmission properties. This electrically insulative system features a high volume resistivity of more than 10¹⁴ ohm-cm and a low dielectric constant of 4.2 at 60 Hz. It has good flowability with a viscosity of 2,000-8,000 cps and can be used for bonding, sealing and coating. LED405Med cures up to 0.125 inch thick and is suitable for small encapsulations involving optical assemblies or other sensitive components.

This no-mix system cures fully tack-free upon exposure to a 405 nm wavelength light source without any oxygen inhibition. In thinner sections, full cures can be achieved in 30-45 seconds. The rate of cure depends upon the intensity of the light source, the thickness of the adhesive layer and the distance from the light to the adhesive. LED405Med is serviceable from -60°F to +250°F and withstands gamma radiation as well as various chemical sterilants including EtO.

Master Bond LED Curing Adhesives

Master Bond LED405Med is a single component, LED curing adhesive, sealant, coating and encapsulating compound for medical device assembly. This nanosilica filled system offers high optical clarity, dimensional stability and electrical insulation properties. Read more about Master Bond’s LED curing adhesives at https://www.masterbond.com/products/led-light-curable-adhesives or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com.

EP21LVSP6 is well suited for potting and encapsulation application as it has a desirable combination of a long open time, low viscosity and excellent electrical insulation properties. It also features a very low exotherm and can be used for casting in deep cross-section thicknesses. This two component epoxy is formulated to cure at room temperature and bonds well to a wide variety of substrates.

 

Master Bond EP39MAOHT is a room temperature curing system for demanding bonding, sealing, coating, potting and encapsulation applications. “It is a versatile product that combines convenient handing, good flow, thermal conductivity, electrical insulation and high temperature resistance,” said Robert Michaels, vice president of technical support. “Its toughness lessens the chance of stress cracking when thermally cycled and its low exotherm makes it particularly useful for mid-to-large sized potting applications.”

EP39MAOHT has a low mixed viscosity of 3,000-6,000 cps as well as a convenient one to one mix ratio by weight and a long working life of 120-150 minutes for a 100 gram batch. This dimensionally stable system bonds well to a wide variety of substrates including metals, ceramics, composites and glass as well as many rubbers and plastics with very low shrinkage upon curing.

This formulation features reliable thermal conductivity of 9-10 BTU•in/ft²•hr•°F [1.30-1.44 W/(m•K)], while retaining superior electrical insulation properties, including a volume resistivity of >10¹⁴ ohm-cm and a dielectric constant of 4.8 at 60 Hz. It offers chemical resistance to water, fuels and hydraulic fluids as well as many acids and bases. EP39MAOHT is serviceable from -100°F to +400°F. The combination of these performance properties makes it well suited for application in the aerospace, electronic, electrical, optical and specialty OEM industries.

EP39MAOHT is off-white in color and is available for use in 1/2 pint, pint, quart, gallon and 5 gallon container kits.

Master Bond EP29LPHE is a two component epoxy system with a low mixed viscosity of 350-700 cps. This low shrinkage/low exotherm product is particularly well suited for large volume casting applications as well as bonding, coating and sealing. “What sets EP29LPHE apart from other epoxies is that while it cures relatively rigid, it has excellent toughness, provides a low moduls and high elongation, which allows it to withstand shock and impact,” said Rohit Ramnath, senior product engineer. This compound features a Shore D hardness of 50-60 and a tensile elongation of 100-150% at room temperature.

As a two part system, EP29LPHE has a forgiving 100 to 80 mix ratio by weight and has an exceptionally long working life of 12-24 hours at room temperature for a 100 gram batch. It will cure at room temperature or more rapidly at elevated temperatures. This system bonds well to a wide variety of substrates including metals, ceramics, glass, composites, rubbers and plastics, including fiber reinforced plastics and optical fibers.

EP29LPHE has superb optical clarity and light transmission properties. It resists exposure to chemicals including water, acids, bases, oils and fuels. Most notable is that it is a dependable electrical insulator with a volume resistivity of >10¹⁵ ohm-cm. Its temperature resistance is from -60°F to +250°F [-51°C to +121°C]. EP29LPHE is available for use in ½ pint, pint, quart, gallon and 5 gallon container kits.

Master Bond Low Exotherm Adhesives

EP29LPHE is a low viscosity epoxy system that features a long working life, reliable electrical insulation and low exotherm suitable for large potting and encapsulation applications. Read more about Master Bond’s low exotherm adhesives at http://www.masterbond.com/properties/low-exothermic-epoxy-systems or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com.

About Master Bond
Since its founding in 1976, Master Bond has been committed to developing epoxies, silicones, light curing systems and other specialty adhesives that meet specific customer requirements. Master Bond manufactures over 3,000 grades of specially designed formulations that are widely used across a variety of industries including electronic, medical, aerospace and optical. 

Ideal for potting and encapsulation applications, MasterSil 157 is a two component silicone system that features low viscosity and low exotherm. It has superior electrical insulation properties and can cure in sections beyond 1 inch thick.

MasterSil 157 is serviceable over the wide temperature range of -175°F to +500°F [-115°C to +260°C]. “This product was formulated for applications that require a silicone to operate under low temperatures,” said Venkat Nandivada, manager of technical support. “Typically, silicones are better suited to withstand high temperatures, so MasterSil 157 fills that need.”

Similar to traditional silicones, MasterSil 157 is highly flexible with an elongation of 110-140%, enabling it to withstand rigorous thermal cycling and shock. Featuring a refractive index of 1.43, it has excellent optical clarity and the ability to transmit light from 220-2,500 nanometers. “Its optical clarity makes it a good fit for many applications in the optical industry like optical fiber cladding and encapsulating LEDs,” said Nandivada. MasterSil 157 can also be used in the opto-electronic and specialty OEM industries.

This addition cured system does not require exposure to air for complete cross-linking. It has a ten to one mix ratio by weight and will not outgas while curing. MasterSil 157 also offers a long pot life of 2-4 hours at room temperature for a 100 gram mass.

MasterSil 157 is available for use in ½ pints, pints, quarts, gallons and 5 gallon container kits.

Developed for chip-on-board encapsulation applications, Master Bond Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system that can be used for dam-and-fill. This video demonstrates the process of dispensing the epoxy paste and creating a barrier, or “dam”, which can then be filled by a flowable encapsulant. This thermally conductive compound also meets NASA low outgassing specifications and can withstand 1,000 hours at 85°C/85% RH.
 

Certified to meet ASTM E595 NASA low outgassing standards, Master Bond EP46HT-2AO Black is well suited for the aerospace, electronic, opto-electronic industries and can be used vacuum environments. This two component system blends thermal stability with a high strength profile for a variety of bonding, sealing and encapsulation applications.

EP46HT-2AO Black combines superior thermal conductivity of 9-10 BTU•in/ft²•hr•°F [1.2981-1.4423 W/(m·K)] and reliable electrical insulation with a volume resistivity exceeding 10¹⁴ohm-cm at room temperature. It has a glass transition temperature of 200-210°C and is serviceable over the wide temperature range of -100°F to +500°F [-73°C to +260°C]. This dimensionally stable system delivers a tensile strength of 6,000-7,000 psi, compressive strength of 26,000-28,000 psi and tensile lap shear strength of 1,400-1,600 psi at 75°F. EP46HT-2AO Black also withstands a variety of chemicals including oils, water, acids, bases and fuels.

Unlike most traditional two part epoxies, EP46HT-2AO Black cures with the addition of heat, which allows it to have a working life of over 24 hours. It has a forgiving 100 to 30-35 mix ratio by weight and upon mixing, this thixotropic system has a viscosity of 140,000-280,000 cps. It bonds well to metals, composites, glass, ceramics, rubbers and many plastics.

This epoxy is available in ½ pint, pint, quart, gallon and 5 gallon container kits. Part A of this system is black in color and Part B is gray. EP46HT-2AO Black has a minimum 6 month, maximum 1 year shelf life at ambient temperatures in original, unopened containers.

Formulated with unique optical properties, EP30-2LB blocks UV light from 200-400 nm and allows the transmission of visible light from 450-900 nm. Beyond its optical properties, EP30-2LB is a reliable structural adhesive. It is dimensionally stable and exhibits low shrinkage upon cure. This low viscosity epoxy flows smoothly and evenly, enabling it to be used for coating, bonding and sealing applications.

This optically clear, two part system passes NASA low outgassing specifications. EP30-2LB resists chemicals including water, oils, fuels, acids, bases and many solvents. Some additional properties include:

• Superb optical clarity - Retractive index: 1.55
• Wide service temperature range - -80°F to +300°F [-62°C to +149°C]
• High strength profile - Tensile lap shear strength: 3,000-3,200 psi
• Capable electrical insulator - Volume resistivity: >10¹⁵ ohm-cm

Widely used in the electronic, aerospace, optical and specialty OEM industries, Master Bond EP126 excels in high temperature applications up to +600°F. This two component product features unique handling properties as Part A is a moderate viscosity liquid and Part B is a powder. It can be easily mixed using a forgiving 100 to 50 ratio by weight. The mixed system is a malleable paste, with an exceedingly long open time of more than 5 days for a 100 gram batch. The curing is straightforward; 3-4 hours at 300°F or 2-3 hours at 350°F.

EP126 adheres well to many substrates including metals, composites, glass, ceramics, rubbers and many plastics. It offers a high tensile lap shear strength, tensile modulus and compressive strength of over 2,800 psi, 425,000-475,000 psi and 32,000-34,000 psi, respectively. This epoxy compound resists a variety of chemicals such as water, oils, acids, bases and many solvents. Additionally, it is formulated as a toughened system allowing it to withstand rigorous thermal cycling.

EP126 is dimensionally stable, has low shrinkage upon curing and is machineable. It also is a very good electrical insulator, especially as it retains high dielectric strength at elevated temperatures. When used as an adhesive and sealant, EP126 can be conveniently applied with a spatula or knife. This product has a service temperature range of -80°F to +600°F. EP126 features a shelf life of 6 months in its original, unopened containers and is available in kits ranging from ½ pints to 5 gallons.

For more information on EP126, request a technical data sheet.