Retronix Ltd

A large investment into BGA reballing has meant we can reball BGA and uBGA devices without generating a thermal cycle or mass reflow. A thermal or mass reflow could potentially damage the cohesion of a device during the reballing process. We use laser energy pulses to attach solder spheres to a pad in less than 20m/s.

As we can attach the spheres to the pad so quickly, we eliminate the heat dissipation into the silicon die and provide a safe alternative to damaging mass reflow.

For the reballing process we can contain equipment in clean room environments combined with laminar flow hoods and nitrogen chamber. Our BGA reballing services means we can process spheres in a range of sizes from 760 microns to 100 microns.