White Paper: When to Use a Fast Cure Adhesive
1 September 2016Fast cure adhesives can reduce assembly costs, but engineers should question the need for speed when selecting adhesives. This white paper provides an overview of the different types of fast cure adhesives, the strengths and weaknesses of each formulation, and factors to consider when optimizing speed in the assembly process.
High Viscosity System with Superior Non-Yellowing Properties
UV15X-5 is a high performance UV curing urethane acrylate type system with impressive physical strength properties and toughness. This one part system cures readily in 10-30 seconds when exposed to a UV light source emitting at a wavelength of 320-365 nm. It is particularly useful for bonding dissimilar substrates and for withstanding rigorous thermal cycling. It has outstanding chemical resistance to water, oils and cleaning agents. Other favorable characteristics include top notch electrical insulation values and superb abrasion resistance.
For more information, request a technical data sheet on UV15X-5
Ultra Fast, High Temperature Resistant Silicone System
One component MasterSil 711 is a room temperature, non-corrosive curing silicone compound for bonding, sealing, coating and formed-in-place gaskets. It offers superior shock/impact resistance and is ideally suited for sealing delicate electronic components. Flexible bonds are formed when exposed to atmospheric moisture. MasterSil 711 requires no mixing or heat, and sets within 2-3 minutes.
For more information, request a technical data sheet on MasterSil 711
Fast Setting Metal Bonding System
EP65HT-1 offers the unique combination of ultra fast cures at room temperature and high thermal stability. This two component epoxy sets up in just 3-5 minutes at 75°F and can withstand temperatures up to 400°F [204°C]. It has a remarkable glass transition temperature of about 125°C. It also meets NASA low outgassing requirements. Available for use in a convenient application gun, this compound features both superior dimensional stability and high tensile strength properties.
For more information, request a technical data sheet on EP65HT-1
Electrically Insulative Snap Cure Epoxy
Master Bond EP17HT-3 is a one part, snap curing system that sets up in 20-30 seconds and fully cure in just 2-3 minutes at 250-300°F. Unlike many other one component epoxies, EP17HT-3 can be cured in sections up to ¼ inch thick. It has excellent electrical insulation characteristics, superior chemical resistance and outstanding physical strength properties. This product is serviceable from -60°F to +400°F [-51°C to +204°C].
Cyanoacrylate Adhesive Passes USP Class VI Certification
Master Bond MB297Med is a single part, room temperature rapidly curing adhesive which has excellent bond strength to a wide variety of similar and dissimilar substrates. MB297Med is 100% reactive and contains no solvents or diluents. It resists EtO, gamma radiation and many other chemical sterilants.
For more information, request a technical data sheet on MB297Med