Master Bond Inc

Master Bond EP4S-80 is a one component silver filled epoxy which meets NASA low outgassing requirements. It has an unlimited working life at room temperature and a moderate heat cure requirement of 80°C. With a viscosity of 10,000-15,000 cps, EP4S-80 has a smooth flow and is easily brushable, making it ideal for EMI/RFI shielding and static dissipation. This formulation can also be used in a variety of applications where electrical conductivity is required: bonding, sealing, coating, as well as gap filling and encapsulating.

EP4S-80 features excellent mechanical properties with a tensile modulus of 500,000-600,000 psi and a compressive strength of 22,000-24,000 psi at 25°C. This electrically conductive system offers a volume resistivity of 0.02-0.06 ohm-cm and a thermal conductivity of 1.30-1.44 W/(m•K). Upon curing, EP4S-80 offers low shrinkage, excellent dimensional stability and a glass transition temperature of 130-135°C. Serviceable over the temperature range of -60°C to +150°C [-75°F to +300°F], this compound adheres well to a variety of substrates such as metals, composites, glass, ceramics, semiconductor materials and many plastics. It is packaged in ounce and pound jars.

Master Bond EP40TC is a two part epoxy system, designed for bonding, sealing and encapsulating applications where thermal conductivity and electrical insulation are required. With a high thermal conductivity value of 8-11 BTU•in/(ft² •hr•°F) [1.16-1.60 W/(m•K)], it is formulated with a small particle size filler making it ideal for filling small cavities and applying the product in thin sections. Its volume resistivity is greater than 10¹⁵ ohm-cm.

“EP40TC’s key distinguishing factor is that there is no compromise on the bond strength while providing excellent elongation and toughness. It has a high strength profile with a tensile lap shear strength of 2,300-2,500 psi, an elongation of 60-70%, and a tensile modulus of 5,000-15,000 psi,” says Rohit Ramnath, Senior Product Engineer. “Also, it meets NASA low outgassing specifications which is a prerequisite for many aerospace, electronic, and optical applications.”

Serviceable from -100°F to +300°F, this toughened system resists thermal cycling, vibration and shock. EP40TC exhibits a high peel strength of 40-60 pli and Shore D hardness of 70-80 at 75°F. It features a convenient 1:1 mix ratio, and cures in 2-3 days at room temperature or faster with the addition of heat. This compound adheres well to a variety of substrates such as metals, composites, glass, and many plastics. EP40TC is available in standard packaging, as well as premixed and frozen syringes.

Master Bond Thermally Conductive, Electrically Insulating Adhesives

Master Bond EP40TC is a two part epoxy system used for bonding, sealing and encapsulating. It meets NASA low outgassing requirements and is able to transfer heat without conducting electricity. Read more about Master Bond’s electrically insulating adhesives at https://www.masterbond.com/properties/electrically-insulative-adhesive-systems or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com.

Master Bond EP62-1HTMed is a two part epoxy that meets the requirements of ISO 10993-5 for non-cytotoxicity and therefore can be utilized in many medical device applications. It features high temperature resistance, good flow properties and is suitable for bonding, sealing and coating.

“This product resists repeated sterilization cycles, including STERRAD® and autoclaving. It is also capable of withstanding exposure to gamma radiation, ethylene oxide, bleach as well as other aggressive sterilants and chemicals. EP62-1HTMed offers a tensile strength of 10,000-11,000 psi and adheres well to a variety of similar and dissimilar substrates, including metals, plastics, rubbers, ceramics and composites. This electrically insulative compound has a volume resistivity of more than 10¹⁴ ohm-cm, a glass transition temperature of 150-155°C and is serviceable from -60°F to +450°F [-51°C to +232°C].

EP62-1HTMed has an advantageously long working life of 12-24 hours for a 100 gram mass and requires moderate heat for curing. Cure schedule options are 60-70 minutes at 176-212°F [80-100°C] or 20-30 minutes at 257°F [125°C]. Post curing at 212-302°F [100-150°C] for 3-5 hours is recommended to achieve optimal performance properties. The epoxy contains no solvents or diluents and has low shrinkage upon cure with a hardness of 80-90 Shore D. This system has a mix ratio by weight of 100 to 5 and can be supplied in standard sized units: ½ pint, pint, quart, and gallon kits. It can also be packaged in premixed and frozen syringes, which ensures that there is no mixing involved and makes it compatible for automated dispensing systems to streamline production.

Master Bond LED405FL3 is a flexible one component, LED curing adhesive system with excellent optical clarity and a refractive index of 1.51. Its flexibility allows for stress minimization especially when bonding substrates with different coefficients of thermal expansion. It also utilizes a fluorescent dye for detection purposes, which enables easy visual inspection.

This no-mix system cures fully tack-free upon exposure to a 405 nm wavelength light source without any oxygen inhibition. In thinner sections, full cures can be achieved in 30-45 seconds. The rate of cure depends upon the intensity of the light source, the thickness of the adhesive layer and the distance from the light to the adhesive. LED405FL3 is serviceable from -100°F to +250°F. It cures with a hardness of around 5-15 Shore D at room temperature. Additional performance properties include electrical insulation as well as resistance to thermal cycling, shock and vibration.

LED405FL3 is a low viscosity system that may be used for small potting and encapsulation applications assuming that there are no shadows or concealed areas. This solvent free, RoHS compliant compound is available in syringes, ½ pint, pint and quart containers.

Master Bond LED Curing Adhesives

Master Bond EP5G-80 is a one component, NASA low outgassing rated epoxy, with a moderate temperature cure requirement of 80°C for 4 hours. This graphite filled compound is not premixed and frozen and has an unlimited working life at room temperature. It offers electrical conductivity with a volume resistivity of 5-15 ohm-cm and a thermal conductivity of 2.88-3.46 W/(m•K) at room temperature.

“EP5G-80 is a specialty non-metallic system designed for heat sensitive electronic applications where high levels of conductivity are desired. Its key feature is that it does not need elevated heat to fully cure,” says Rohit Ramnath, Senior Product Engineer. “Unlike other graphite filled adhesives, EP5G-80 is a smooth thixotropic paste and can be easily dispensed manually or using automated systems.”

For a conductive system, EP5G-80 provides an especially high Tg of around 130°-140°C, and a tensile modulus that exceeds 1,000,000 psi at room temperature. It is serviceable over the temperature range of -50°C to +175°C and has a low coefficient of thermal expansion. Suitable for bonding, sealing and coating, EP5G-80 adheres well to a variety of substrates such as metals, composites, ceramics and many plastics. This formulation features a good lubricity and can be employed for static dissipation and EMI/RFI shielding applications. It is black in color and RoHS compliant. Packaging is available in syringes, jar and pint containers.

Master Bond Thermally Conductive Epoxies

Master Bond EP5G-80 is a one part, non-premixed and frozen epoxy system used for bonding, sealing and coating. This graphite filled system exhibits high electrical and thermal conductivity and meets NASA low outgassing requirements. It is syringe dispensable, can cure at temperatures as low as 80°C and provides excellent heat resistance. Read more about Master Bond’s thermally conductive adhesives at https://www.masterbond.com/properties/thermally-conductive-epoxy-adhesives or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com.

Master Bond EP3HTS-TC is a one part, NASA low outgassing rated epoxy, with an outstanding thermal conductivity of 16-17 W/(m·K). It cures rapidly at temperatures of around 250-300°F [~ 125-150°C], and has an unlimited working life at room temperature. The material features a thixotropic paste consistency and is not pre-mixed and frozen. It is well suited for automatic dispensing equipment or manual syringes and can be applied without any tailing. Primarily, it is formulated for use as a die attach and special purpose bonding material.

“EP3HTS-TC utilizes a non-sintering silver technology to provide ultra high heat transfer capability.” says Rohit Ramnath, Senior Product Engineer. “It is designed without compromise to dispensability or adhesion strength, while maximizing performance properties.” EP3HTS-TC is highly electrically conductive, with a volume resistivity of less than 1x10^-6 ohm-cm.

The system exhibits good dimensional stability, resists thermal cycling, and has a low coefficient of thermal expansion of 20-23 x 10^-6 in/in/°C. Die shear strength is 9-12 kg-f at 75°F for a 2 x 2 mm [80 x 80 mil] area. It has a glass transition temperature of 58°C and is serviceable over the temperature range of -80°F to +400°F. This compound adheres well to a variety of substrates such as metals, composites, glass, ceramics, semiconductor materials and many plastics. Packaging is available in syringes, 20, 50 and 100 gram jars, as well as single and multiple pound containers.

Master Bond Thermally Conductive, NASA Low Outgassing Systems

Master Bond EP3HTS-TC is a one part epoxy system with a paste consistency for die attach and bonding applications. It meets NASA low outgassing requirements and has ultra high thermal conductivity. Read more about Master Bond’s NASA low outgassing adhesives at https://www.masterbond.com/certifications/nasa-low-outgassing or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com.

Master Bond EP41S-5ND Black is a two part, NASA low outgassing rated epoxy, with outstanding chemical resistance to acids, bases, alcohols and fuels. Most significantly it will withstand liquid immersion to harsh chemicals such as methylene chloride, phenol (10%) and nitric acid (30%). This system contains no solvents and cures at room temperature, or more rapidly at elevated temperatures. It provides a high glass transition temperature of 140 to 150°C, and exceptional electrical insulation properties, with a volume resistivity greater than 10¹⁴ ohm-cm.

“EP41S-5ND Black is designed for bonding and sealing applications, wherein a non-sag, paste-like consistency is required.” says Rohit Ramnath, Senior Product Engineer. “The optimum curing schedule is overnight at 75°F followed by 3-4 hours at 150-200°F. In applications where long term chemical resistance is critical, the importance of post-curing with heat cannot be overstated.”

EP41S-5ND Black has a good physical strength profile with a tensile strength measuring between 10,000 and 12,000 psi, and a tensile lap shear of 900-1,100 psi, both at room temperature. It is serviceable over the temperature range of -80°F to +450°F. This compound adheres well to a variety of substrates such as metals, composites, glass, ceramics and many plastics and rubbers. As indicated by the product name, its color is black, and it is RoHS compliant. Packaging is available in ½ pint kits, pint kits, quart kits and gallon kits.

Master Bond Chemically Resistant Epoxies

Master Bond EP41S-5ND Black is a two part epoxy system used for bonding, sealing and coating, with a paste consistency. It meets NASA low outgassing requirements and has remarkable chemical resistance. Read more about Master Bond chemically resistant adhesives at https://www.masterbond.com/properties/chemical-resistance or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com.

Product: EP30-4Med

Master Bond EP30-4Med is a two part epoxy system with a fast set up time that cures at room temperature, or even more rapidly with a bit of heat. This low viscosity system meets the requirements of ISO 10993-5 testing and is therefore considered to be non-cytotoxic. It can be used for bonding, sealing, and small encapsulation applications. It can also be utilized as a coating, especially when optical clarity is needed.

EP30-4Med is designed to not only resist EtO sterilization, but also to withstand most detergents, disinfectants, bleaches and liquid sterilants. It is recommended for applications in medical device manufacturing for both disposable and reusable instruments. EP30-4Med has an easy to handle 2 to 1 mix ratio by weight and possesses a low viscosity of 1,000-3,000 cps for Part A and 20-100 cps for Part B. Mixing is effortless, especially with the use of a double barrel cartridge and static mixer. This epoxy has a refractive index of 1.55 and maintains good electrical insulation properties over time. Its volume resistivity is greater than 10¹⁵ ohm-cm. It forms strong bonds even in thin sections.

EP30-4Med is a relatively fast setting system, and in some cases, depending upon the application and the substrates, fixtures often can be removed in 15-25 minutes. Full cure can be achieved in about 24 hours at 75°F. The ideal cure schedule is around 1-2 hours at 75°F followed by 1-2 hours at 135-150°F. Upon cure, it exhibits a Shore D hardness of 75 to 85. The product is available in 1/2 pint kits, pint kits, quart kits, and gallon kits. Specialty packaging is available in gun dispensers.

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Silicone Adhesive Features High Thermal Conductivity & Electrical Insulation

Master Bond MasterSil 153AO is an addition cured two part silicone with a self priming property. It has a high tensile lap shear strength, especially for a silicone. The system is thermally conductive and electrically insulating. “The key feature of MasterSil 153AO is that it provides the ability to minimize stress, with no compromise on strength. Although it is not considered a structural adhesive, it provides a truly remarkable combination of flexibility and strength that other silicones do not provide”, says Rohit Ramnath, Senior Product Engineer.

This silicone product has an elongation between 100-120%, and a tensile lap shear strength of 700-800 psi. It provides a thermal conductivity of 0.93-1.08 W/(m•K), a volume resistivity of more than 10¹⁴ ohm-cm, a coefficient of thermal expansion of 150-180 x 10^-6 in/in/°C, and hardness of 65-75 Shore A. It is serviceable over the temperature range of -65°F to +400°F.

With an easy to use mix ratio of 1 to 1 by weight, MasterSil 153AO cures with the addition of moderate amounts of heat. For example, optimal cure schedule is overnight at room temperature followed by 2-4 hours at 135°F-185°F. Upon mixing, it retains its smooth paste consistency and minimal flow. It has a long working life of 4 to 6 hours for a 100 gram mass at 75°F.

This compound bonds well to a variety of substrates including metals, glass, ceramics, many plastics and silicone rubbers. It is available for use in kits, with sizes ranging from ½ pint, pint, quart to gallons. It is white in color. MasterSil 153AO is generically low outgassing, contains no solvents, has a low linear shrinkage upon curing and is RoHS compliant.

Master Bond Thermally Conductive Silicone Systems

Master Bond MasterSil 153AO is a two part, thermally conductive, electrically insulating, addition cured silicone. This flexible system can be used in electric vehicles, as well as other applications involving sensitive optical and electronic components, where heat dissipation along with electrical insulation is critical. Read more about Master Bond’s thermally conductive adhesives at https://www.masterbond.com/properties/thermally-conductive-epoxy-adhesives or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com.

For a full product description, please visit: https://www.masterbond.com/tds/mastersil-153ao
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Master Bond Supreme 70CN is a two part epoxy adhesive formulated using a natural, renewable and sustainable ingredient. This moderate viscosity unfilled epoxy is black in color and can be utilized for bonding, sealing, coating and potting. As a toughened system, it resists thermal cycling and is ideal for bonding dissimilar substrates. “As part of Master Bond’s sustainability drive, this product offers the advantage of lowering the carbon footprint. At the same time, it does not compromise performance and features a high tensile strength of over 10,000 psi and a glass transition temperature of 125-130°C”, says Rohit Ramnath, Senior Product Engineer.

Supreme 70CN bonds well to a wide variety of substrates including metals, ceramics, many rubbers, plastic materials, and especially composites, with low shrinkage upon cure. It passes NASA low outgassing specifications, offers excellent chemical resistance, and is serviceable from -100°F to 400°F. This system has a high volume resistivity exceeding 10¹⁴ ohm-cm, and a relatively low exotherm. The product has a Shore D hardness of 75-85 at room temperature.

The formulation exhibits very good flow properties with a mixed viscosity of 2,500 to 5,000 cps and a convenient working life of 60 to 90 minutes. The optimal cure schedule is overnight at room temperature followed by 4-5 hours at 140°F to 170°F. Supreme 70CN can be used in aerospace, electric vehicle, electronic, opto-electronic, battery, and OEM applications, particularly those involving composites and fibers. In addition to specialty packaging in the form of premixed & frozen syringes and syringe kits, it is available in standard packaging of ½ pint, pint, quart and gallon kits.

Master Bond EP77M-FMed is a two part epoxy adhesive and sealant designed for use in the assembly of medical devices. It meets the ISO 10993-5 requirements and is not considered to have a cytotoxic effect. “This product has been formulated to provide excellent electrical and thermal conductivity properties, while keeping in mind processing constraints for heat sensitive components in sensors used for medical devices or wearable electronics,” says Rohit Ramnath, Senior Product Engineer.

As a silver filled system, EP77M-FMed provides excellent electrical conductivity, with a low volume resistivity of 10^-3 ohm-cm. It provides a thermal conductivity of 1.44-1.73 W/(m•K), resists thermal cycling and has a Shore D hardness of 40-50 at room temperature. It can withstand exposure to water, liquid sterilants, anti-microbial disinfectants and EtO sterilization. It offers a tensile strength of 2,000-3,000 psi and a tensile modulus of 250,000-300,000 psi at 75°F. This system is serviceable over the temperature range of -100°F to +250°F.

EP77M-FMed has an easy to use one to one mix ratio by weight or volume and is fast setting, especially when compared to other silver filled systems. It sets up in 15-20 minutes at 75°F and fully cures at room temperature in 24 hours. This compound has a flowable paste like consistency and bonds well to a variety of substrates including metals, glass, ceramics, rubbers and many plastics. It is packaged in 20 gram, 50 gram, 100 gram, one pound and multiple pound cans. The color of Parts A and B is silver. EP77M-FMed does not contain any solvents and is RoHS compliant.

Master Bond EP77M-FMed is a two component epoxy that passes ISO 10993-5 specifications for cytotoxicity. Typically, medical grade adhesives, sealants, coatings and potting/encapsulation compounds need to be non-cytotoxic and show compatibility with blood and body fluids. Read more about Master Bond’s biocompatible adhesives at https://www.masterbond.com/properties/biocompatible-adhesives or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com.

Master Bond EP51CC is a two component, fast setting epoxy with a color coding system where Part A is white and Part B is black. The two parts combine into a uniform gray color paste, which indicates proper mixing. This fast curing, non-drip compound is ideal for bonding and sealing applications with a forgiving mix ratio of one to one by weight or volume.

This high performance epoxy has a rapid set up time, convenient handling, and good physical properties. It sets up very quickly at room temperature, with a working life of 3-5 minutes for a mixed 50 gram batch. The exact fixture time in an application context can vary from a few minutes to several hours, depending on multiple factors including, but not limited to the size of the components, the substrates being bonded, curing temperature and the amount of adhesive applied. An interesting feature of EP51CC is the role that the cure schedule plays in the bond strength. For example, it offers a lap shear strength of 700-800 psi when cured at room temperature for 24 hours, but when cured at room temperature for 8 hours followed by 3 hours at +250°F, its lap shear strength increases to 2,300-2,500 psi. It features high strength bonds to a variety of substrates including metals, composites, glass, ceramics, vulcanized rubbers, and many plastics with a tensile modulus of 100,000-150,000 psi at room temperature. EP51CC is electrically insulative with a volume resistivity of >10¹⁴ohm-cm and a dielectric strength of 450 volts/mil.

Formulated for temperatures ranging from 4K to +250°F, this epoxy is also suitable for challenging cryogenic applications. EP51CC is available in ounce kits, half pint kits, pint kits, quart kits, gun applicators, and FlexiPaks® for ease of use.

Master Bond EP21NS is a two part epoxy that may be used for bonding, coating, sealing and potting/encapsulating. It has a nanosilica filler that imparts dimensional stability and abrasion resistance. When measured according to ASTM D4060 standard test method for abrasion resistance with CS-17 wheel for 1,000 cycles, EP21NS exhibits a very low weight loss of 25 mg. This formulation is a reliable electrical insulation with a volume resistivity greater than 10¹⁵ ohm-cm, an outstanding dielectric constant of 2.8 at 16.4 GHz and a dielectric strength of 450 volts/mil at 75°F, for a 1/8^th inch thick specimen. It is serviceable over the temperature range of -80°F to +250°F.

This system has a long working life and good flow properties with a moderate mixed viscosity of 50,000-90,000 cps. The mix ratio of EP21NS is 1 to 1 by weight, and its optimal cure schedule is overnight at room temperature followed by 4 to 5 hours at 150°F. It features very low shrinkage upon curing, a low coefficient of thermal expansion of 30-35 x 10^-6 x in/in/°C and a compressive strength of 16,000-18,000 psi.

This compound bonds well to a variety of substrates including metals, composites, glass, ceramics, rubbers and many plastics. EP21NS is resistant to water and salts. It is packaged in ounce kits, ½ pint kits, pint kits, and quart kits. The color of Part A is translucent and Part B is amber. EP21NS does not contain solvents and is RoHS compliant.

Master Bond UV15X-6Med-2LV is a UV curable, non-cytotoxic adhesive that features optical clarity and abrasion resistance. Not only can it be utilized for bonding, but it can also be employed for sealing, coating, and encapsulating purposes. It has a high degree of flexibility with an elongation that exceeds 100% and a low tensile modulus of 20,000-50,000 psi at room temperature. This flexibility allows it to withstand extreme thermal cycling and mechanical shock without inducing stress on components/parts. It bonds well to similar and dissimilar substrates including glass, metals and plastics.

UV15X-6Med-2LV is a one part system that cures upon exposure to a UV light source emitting at a wavelength of 320 to 365 nm with an energy output as low as 20-40 milliwatts/cm². It can cure in as little as 10 to 30 seconds, and in sections up to ¼ inch. A successful curing process entails complete exposure to the UV light source, for this reason there should be no shadows or UV blocking agents in the substrates used. As a one part system, it requires no mixing prior to use. This compound has a medium viscosity of 20,000-40,000 cps and is not oxygen inhibited. It is electrically insulative with a volume resistivity of more than 10¹² ohm-cm at room temperature. UV15X-6Med-2LV has a refractive index of 1.50. It is serviceable over the temperature range of -80°F to +250°F.

Master Bond EP4EN-80 is a NASA low outgassing approved epoxy, which can cure at temperatures as low as 80°C, unlike conventional one component heat curing systems. It features a quick cure profile at 65°C for 90 minutes plus 30 minutes at 80-85°C. The epoxy system requires no mixing prior to use, has a very low viscosity of 600-1,800 cps and contains no solvents. Free flowing EP4EN-80 is suitable not just for bonding, but also for small potting and encapsulations up to about a ¼ inch thick in some applications. Due to its ultra fine particle size filler material this system offers unique gap filling and heat transfer capabilities. It has a thermal conductivity value of 0.75-0.85 W/(m•K) and electrical insulation with a volume resistivity of more than 10¹⁴ ohm-cm at room temperature. When used as an adhesive, EP4EN-80 can be applied in thicknesses as thin as 10-15 microns.

EP4EN-80 provides notable strength properties including a compressive strength of 24,000-26,000 psi and an ultra high tensile modulus of 1,200,000-1,400,000 psi at room temperature. It is serviceable over the temperature range of -50°C to +150°C.

EP4EN-80 bonds well to a variety of substrates such as metals, composites, ceramics and many plastics. It effectively resists waters, oils and fuels. This compound is gray in color and is RoHS compliant. Packaging is available in ½ pint, pint, quart and gallon sizes.

Master Bond MasterSil 151S is an addition curing two part silicone system that may be used as an adhesive, sealant, coating or form-in-place gasketing material. A unique feature of this product is that despite its silicone chemistry, it passes NASA low outgassing specifications. Also, it retains superior electrical conductivity with a volume resistivity of 0.004 ohm-cm at 75°F. “This silicone is ideal for applications where low stress is required, since it is highly flexible across a wide service temperature range. It is capable of resisting aggressive thermal cycles and shocks,” says Rohit Ramnath, Senior Product Engineer.

The mix ratio of MasterSil 151S is 100 to 5 by weight, and it cures with the addition of heat. Upon mixing, it retains its smooth, paste consistency, and has a long working life of 6-12 hours for a 50 gram mass. This silicone product has an elongation between 100-150%, tensile strength of 400-700 psi and can cure beyond ¼ inch thick. It features a thermal conductivity of 1.30-1.59 W/(m•K), a coefficient of thermal expansion of 150-200 x 10^-6 in/in/°C, and hardness of 80-90 Shore A. It is serviceable over the temperature range of -80°F to +400°F.

This compound bonds well to a variety of substrates including metals, ceramics, composites and many plastics and rubbers. It is available for use in 20 gram, 50 gram and 100 gram glass jars. The color of Part A is silver and Part B is clear. MasterSil 151S has a low linear shrinkage upon curing and is RoHS compliant.

Master Bond Electrically Conductive Adhesive Systems

Master Bond MasterSil 151S is a two part, electrically conductive silicone that passes NASA low outgassing requirements. This silver filled, highly flexible system can be used for low stress applications. Read more about Master Bond’s electrically conductive adhesives at https://www.masterbond.com/properties/electrically-conductive-adhesive-systems or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com.

Master Bond EP21ARLV is a two part epoxy that may be used as an adhesive, sealant, coating or encapsulant. The product is capable of withstanding prolonged exposure to a wide range of chemicals, such as 70% sulfuric acid, 10% hydrochloric acid, 10% nitric acid and butyl acetate to name a few. Both parts A and B have a low viscosity of 3,000-6,000 cps and 4,000-6,000 cps, respectively. “With its low viscosity and acid resistance, EP21ARLV is a go-to material for potting and encapsulations in battery applications,” says Rohit Ramnath, Senior Product Engineer. “This combination is especially useful in applications where protection from acids is crucial.”

The mix ratio of EP21ARLV is 100 to 50 by weight, and it cures at room temperature. However, the addition of heat not only speeds up the curing process but it is also vital for optimizing acid resistance. It is a reliable electrical insulator with a volume resistivity greater than 10¹⁴ ohm-cm at 75°F, and dielectric strength of 440 volts/mil at 75°F, for a 1/8 inch test sample. Other noteworthy properties include a tensile strength of 8,000-9,000 psi, a Shore D hardness of 80-90 and a tensile modulus of 350,000-400,000 psi. It is serviceable over the temperature range of -60°F to +250°F.

This compound bonds well to a variety of substrates including metals, ceramics, composites and many plastics and rubbers. It is available for use in ½ pint, pint, quart and gallon container kits. Specialty packaging is also available in gun dispensers. The standard color of Part A is clear and Part B is amber clear, although it can be formulated in many different colors upon request. EP21ARLV does not contain solvents and is RoHS compliant.

Master Bond Chemically Resistant Epoxy Systems

Master Bond EP21ARLV is an acid resistant epoxy that features low viscosity, and electrical insulation. This versatile two component system can be used for high performance bonding, sealing, coating and encapsulating. Read more about Master Bond’s chemically resistant adhesives at https://www.masterbond.com/properties/chemical-resistance or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com.

Master Bond EP29LPAOHT is a two component, NASA low outgassing approved epoxy system featuring a long working life of 8-10 hours per 1,000 gram batch. Due to its low exotherm and flowable consistency, this product is suitable for specialty potting applications where large masses of the epoxy need to be cured. It can be mixed and poured in volumes of more than a gallon at a time. Even in deep cross section thicknesses, this product does not generate much heat. Since the epoxy does not start gelling quickly, it is especially advantageous for use in many production environments that require a long open time after mixing.

EP29LPAOHT has a 50 to 100 mix ratio by weight and a mixed viscosity of 10,000-30,000 cps. It possesses a high thermal conductivity value of 0.87-1.15 W/(m•K), and is electrically insulative with a volume resistivity of more than 10¹⁵ ohm-cm. Upon curing EP29LPAOHT exhibits low shrinkage, dimensional stability and a low coefficient of thermal expansion. Other noteworthy properties include a compressive strength of 24,000-26,000 psi, a Shore D hardness of 80-90 and a tensile modulus of 450,000-500,000 psi. This epoxy is serviceable over the wide temperature range of -60°F to +350°F.

EP29LPAOHT bonds well to a variety of substrates including metals, glass, ceramics and many different plastics. It resists many chemicals including, but not limited to, water, fuels and oils. It is available for use in ½ pint, pint, quart and gallon container kits. EP29LPAOHT does not contain solvents and is RoHS compliant.

Master Bond EP42HT-4AOMed Black is a new two part epoxy created for medical device manufacturing. It is biocompatible and non-cytotoxic, passing both USP Class VI and ISO 10993-5 certifications. This epoxy withstands aggressive chemical sterilants, radiation and repeated cycles of autoclaving.

EP42HT-4AOMed Black offers both cryogenic serviceability and heat resistance with a service temperature range from 4K to 400°F. Its thermal conductivity measures 9-10 BTU•in/(ft²•hr•°F) and its volume resistivity is greater than 10¹⁴ ohm-cm. The system contains a filler, which contributes to its high strength profile and dimensional stability. This adhesive bonds well to metals, composites, glass, ceramics, rubbers and plastics and features a tensile modulus of 500,000-550,000 psi, a compressive strength of 24,000-26,000 psi, and a tensile strength of 7,000-8,000 psi.

This epoxy can cure at room temperature, yet faster cures can be achieved by heat curing. In order to obtain optimal properties, an overnight cure at room temperature, followed by heat curing at 150-200°F for 2-3 hours is recommended. The mix ratio is 100 to 40 by weight. Once mixed, this versatile adhesive has very good flow properties, making it suitable for bonding, sealing and coating applications. Upon curing, EP42HT-4AOMed Black exhibits very low shrinkage, low exotherm and can be used for castings up to 2-3 inches thick. This opaque black epoxy is available in the following size kits: ½ pint, pint, quart and gallon. It is also available in pre-mixed and frozen syringes, which are compatible with automated dispensing equipment.

Master Bond Medical Adhesive Systems

Master Bond EP42HT-4AOMed Black is a two component epoxy adhesive system developed for medical device applications. It passes USP Class VI and ISO 10993-5 certifications and successfully resists multiple sterilization methods. Read more about Master Bond’s adhesives, sealants and coatings for medical device manufacturing at https://www.masterbond.com/industries/medical-adhesives-sealants-and-coatings or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com.

Master Bond EP36FR is a specialized one part epoxy that meets Airbus specifications for toxic gas emissions per AITM 3.0005, Issue 2 in the flaming mode and Section 7.4 of ABD0031, Issue F. It also passes the 12 second vertical burn test per AITM 2.0002B and Section 7.1.2 of ABD0031, Issue F. EP36FR uses a non-halogenated filler. “These Airbus ratings are not just relevant for manufacturing aircraft components, but they are also considered to be among the most stringent of certifications for flame retardancy and toxicity,” said Rohit Ramnath, senior product engineer. “They [the ratings] serve as a good starting point for various composite applications across the aerospace, marine, transportation, electrical, and automotive industries.”

EP36FR withstands rigorous thermal cycling, as well as thermal and mechanical shocks. It has excellent high temperature resistance up to 500°F, despite a low glass transition temperature of 95-100°F. This system maintains its toughness or hardness across a wide temperature range and is ideal for potting, encapsulation, sealing as well as coating applications. The hardness values at 212°F and 300°F are in the 20-30 Shore D range.

The EP36FR formulation is B-staged, meaning it is a solid at room temperature and must be heated in a forced air or convection oven to transform it to a liquid at around 200°F. This feature allows it to be reused when it resolidifies at room temperature, provided it has not been cured. After liquefying the product at 200°F, and applying it on the substrates in the application, it needs to be heat cured for 2 to 3 hours at 350°F.

Master Bond EP36FR bonds well to metals, composites, glass and many plastics. The product is available in ½ pint, pint, quart and 30 gram preforms.

EP42-2LV Black is a two part epoxy with low viscosity and good flow. It withstands prolonged immersion in many acids, bases, solvents, fuels and oils. This versatile system can be used for bonding, sealing, coating and casting, where a strong chemical resistance profile is required.

This compound has an easy to use mix ratio of 100 to 40 by weight or 100 to 50 by volume with Part A being black and Part B being light amber. The viscosity of the mixed system is around 1,000-2,000 cps, and it has a long working life of 60 to 90 minutes per 100 gram batch. EP42-2LV Black cures optically opaque at room temperature in 2 to 3 days or at elevated temperatures of 200°F in 2 to 3 hours. For optimal performance, the recommended cure schedule is overnight at room temperature followed by heat curing at 150-200°F for 2 to 4 hours.

It meets NASA low outgassing specifications and is serviceable over a wide temperature range from -60°F to 350°F. This system is electrically insulative with a volume resistivity greater than 10¹⁴ ohm-cm and a dielectric constant of 4.0 at 60 Hz, at room temperature. These attributes, combined with its relatively long working life and lower exotherm, make EP42-2LV Black suitable for many larger potting and encapsulation applications.

EP42-2LV Black is recommended for applications in aerospace, electronic, optical and OEM industries. It is available in 1/2 pint, pint, quart, and gallon kits. Specialty packaging is also available in gun dispensers and premixed and frozen syringes.

Master Bond EP40Med, a two part epoxy system, combines toughness and a low tensile modulus while still providing a relatively high lap shear strength. It meets the requirements of ISO 10993-5 testing and is therefore considered to be non-cytotoxic. This compound can be used for bonding, sealing, coating and encapsulating.

EP40Med resists sterilization to gamma, EtO, chemicals, and liquid disinfectants. It is recommended for use in medical device manufacturing and repair for both disposable and reusable instruments. EP40Med is an effective adhesive for applications where toughness and flexibility along with good structural strength are needed. The formulation bonds well to polycarbonates, acrylics, metals, ceramics and composites. This flexible epoxy has an elongation of 80-90%, a lap shear strength of 1,600 to 1,800 psi and a low tensile modulus of 25,000 to 50,000 psi. EP40Med is a reliable electrical insulator with a volume resistivity over 10¹² ohm-cm.

This system is easy to use with a one to one mix ratio by weight or volume and a low to moderate viscosity of both parts A and B. The working life of a mixed 100 gram batch is approximately 120-150 minutes. The optimal cure schedule is overnight at room temperature followed by a post cure for 2-3 hours at 150°F. The product is available in 1/2 pint, pint, quart, and gallon kits. Specialty packaging is available in gun dispensers and premixed and frozen syringes.

Master Bond Biocompatible Adhesives

Master Bond EP40Med is a two component, biocompatible epoxy system formulated for medical device manufacturing applications. Read more about Master Bond’s biocompatible adhesives that pass USP Class VI and ISO 10993-5 certifications at https://www.masterbond.com/properties/biocompatible-adhesive or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com.

Master Bond EP35SP is a two part epoxy system for bonding and sealing applications, providing resistance to many chemicals such as oils, acids, bases, water, fuels, and especially petrochemicals. It features both a high glass transition temperature (T_g) and a broad service temperature range. Its T_g measures 215-220°C and its serviceability extends from -62°C to +288°C (-80°F to 550°F).

EP35SP has notable dielectric properties with a dielectric constant of 4.5 at 60 Hz and a volume resistivity greater than 10¹⁴ ohm-cm. It bonds well to a wide array of substrates including metals, several plastics, ceramics, glass and composites. Upon curing, this system offers low shrinkage and good dimensional stability. Its tensile modulus is 550,000-600,000 psi with an overall superior physical strength profile even under adverse environmental conditions.

EP35SP has a paste viscosity, with little to no flow, and can be applied on vertical surfaces. The mix ratio is an easy to use 100 to 50 by weight. The system has a long working life of 24 to 48 hours. For optimal properties, the recommended cure schedule is 1 hour at 110°C followed by 2-3 hours at 125-150°C, plus a post cure at 175°C for 2-3 hours. Due to its high temperature resistance and structural properties, EP35SP may be considered for bonding and sealing in downhole, aerospace, electronic, optical and specialty OEM applications. Other uses may apply as well. The product is available in 1/2 pint, pint, quart, gallon and 5 gallon kits.

Master Bond High T_g Adhesives

Master Bond EP35SP is a two component epoxy system with high T_g and a paste consistency. It is formulated to withstand aggressive chemicals and high temperatures. Read more about Master Bond’s high T_g adhesives at https://www.masterbond.com/properties/epoxy-adhesive-systems-high-glass-transition-temperature or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com

Master Bond EP17HTS-DA is a new one component, no mix, die attach epoxy that is electrically conductive and withstands high temperatures. It is a silver filled system. Typically, glass transition temperature (T_g) declines with the addition of a filler like silver. However, with this specialty formulation, a high T_g of 140-150°C is maintained and it passes MIL-STD-883J thermal stability requirements at 200°C.

Its strength profile is also notably robust with a die shear strength of 35-40 kg-f at room temperature. EP17HTS-DA meets NASA low outgassing specifications and its service temperature extends from -80°F to 550°F. It has a low volume resistivity of less than 0.005 ohm-cm and also performs well as a heat conductor.

EP17HTS-DA is a thixotropic paste and can be easily dispensed manually or via automated dispensing systems. This compound is not premixed and frozen and has an unlimited working life at room temperature. It requires a heat cure of 300°F for 2 to 3 hours, followed by post curing at 350°F for 1 to 2 hours.

This product bonds well to many substrates including metals, ceramics and plastics. It is recommended for applications where low volume resistivity and high temperature resistance is required. EP17HTS-DA is available for use in syringes and glass jars, in sizes ranging from 20 grams to several pounds.

Master Bond EP21TPHT is a new two component epoxy polysulfide system designed for bonding applications that require toughened and thermally stable bonds resistant to chemicals. It resists temperatures up to 350°F, much higher than typical epoxy polysulfide systems. This room temperature curable adhesive also features convenient handling characteristics with a 1 to 1 mix ratio by weight or volume and an easily flowable mixed viscosity of 5,000-15,000 cps.

“EP21TPHT offers a high lap shear strength of 1,600-1,800 psi and bonds well to a variety of substrates including metals, composites, glass, ceramics, and many rubbers. It is a toughened compound with good elongation of 20-40%, and a relatively low tensile modulus of 30,000-50,000 psi at room temperature”, says Rohit Ramnath, Senior Product Engineer. “This combination of properties makes it suitable for applications involving thermal cycling and mechanical stresses.”

EP21TPHT is an electrically insulative material with a dielectric constant of 3.9 and volume resistivity of more than 10¹⁴ ohm-cm at 75°F. It withstands exposure to a wide range of chemicals including but not limited to fuels, oils, hydrocarbons and hydraulic fluids. EP21TPHT offers a unique combination of performance properties advantageous in many applications in the aerospace, military, electronic, electrical, and specialty OEM industries. This product is available for use in double barrel syringes and gun dispensers, as well as in ½ pint, pint, quart or gallon container kits.

Master Bond Chemically Resistant Adhesives

Master Bond EP21TPHT is a two component epoxy polysulfide system with excellent resistance to fuels, oils, and similar chemicals. As a flexibilized and toughened system, it can withstand thermal cycling and mechanical stresses. Read more about Master Bond’s chemically resistant adhesives at https://www.masterbond.com/properties/chemical-resistance or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com.