Master Bond Supreme 11AOHT is a two component epoxy resin system for high performance bonding and sealing. It is formulated to cure at room temperature or more rapidly at elevated temperatures with a convenient one to one mix ratio by weight or volume. Its most outstanding features include high thermal conductivity, excellent electrical insulation properties and temperature resistance up to 400°F. Supreme 11AOHT is a "toughened" system which enables it to withstand rigorous thermal cycling and makes it well suited for bonding dissimilar substrates.
