Kohesi Bond

Kohesi Bond’s exclusive products offer resistance to a sweeping range of chemicals. Our specialty systems are designed specifically to withstand prolonged exposure to vigorous chemicals. Our chemically resistant systems are widely used in chemical tanks, piping, medical devices, processing plants, off-shore oil and gas industries and numerous other applications. We test our products for long-term immersions in a variety of acids, bases, alcohols, solvents, water, oils, fuels and sterilants among many others. Our reliable, expansive data is used to custom formulate products that meet specific end-user requirements.

POPULAR PRODUCTS

1. KB 1151 S-1: KB 1151 S-1 is a two component epoxy system that can be cured at room temperature. This unique system offers outstanding resistance to various fuels, organic solvents and alcohols.

2. KB 1452 HT-2: KB 1452 HT-2 is a specially designed adhesive system that is capable of passing USP Class VI and ISO 10993-5 cytotoxicity tests. This product can withstand multiple sterilization cycles even at elevated temperatures.

3. KB 1048: KB 1048 is an optically clear, rigid curing epoxy system that can withstand exposure to moisture, boiling water and many other acids.

4. KB 1372-LO: KB 1372-LO is our two component epoxy system that offers exceptional resistance to acids and various other chemicals even at elevated temperatures. In addition, it is capable of passing NASA standards for low outgassing (ASTM E-595).  

KB 1040-2: KB 1040-2 is highly optically clear product that can be serviced at cryogenic temperatures as well as offer good resistance to many chemicals. This product is capable of passing NASA standards for low outgassing (ASTM E-595).

Cryogenic Adhesives

Kohesi Bond custom formulates specialty epoxy systems that are capable of withstanding cryogenic temperatures and shocks. Cryogenic temperatures are typically referred to temperatures below -180°C (93.15K). Our cryogenic adhesives, sealants and coatings are capable of withstanding temperatures down to 4K. These unique products are commonly used in sensors, cryosurgery or cryotherapy, satellites, energy storage, high energy physics, nuclear magnetic resonance spectroscopy (NMR), magnetic resonance imaging (MRI), cryogenic transfer pumps and valves, blood banking and superconductivity applications. Distinct grades are available that offer electrical conductivity, thermal conductivity, optical clarity, electrical insulation and are capable of meeting stringent industrial certifications.

POPULAR PRODUCTS

1. TUF 1828 TC: TUF 1828 TC is a special one component adhesive that is cryogenically serviceable and can be applied in extremely thin sections. This low thermal resistance product offers a thermal conductivity of > 3.4 W/m/K.

2. KB 1039 CRLP: KB 1039 CRLP-AO is a two component, room temperature epoxy system suitable that offers cryogenic serviceability and is optically clear. It offers excellent adhesion to a wide range of substrates and has a long pot life.

TUF 1820 ANHT: TUF 1820 ANHT is a one part, toughened, heat curing epoxy system that offers phenomenal thermal conductivity and cryogenically serviceable.

• ELECTRICALLY CONDUCTIVE ADHESIVES

Kohesi Bond offers a comprehensive range of custom-made electrically conductive systems that suit your specific requirements. Electrical conductivity refers to a material’s ability to easily allow flow of electrical current. Various fillers are employed to make our epoxy systems excellent conductors of electricity. These include:

Silver Filled Adhesives: Silver filled systems offer the highest electrical conductivity and the lowest volume resistivity of <10-3 ohm-cm. They are commonly used to replace solder.

Silver-coated Nickel Adhesives: Silver-coated nickel filled products offer a more cost effective alternative to silver filled systems, while maintaining very low volume resistivity of < 0.005 ohm-cm.

Nickel Filled Adhesives: Nickel filled systems offer a cost effective solution where high electrical conductivity is required. Typically, they offer a low volume resistivity of 5 – 10 ohm-cm.

Graphite Filled Adhesives: Graphite filled products offer an economical solution while maintaining good electrical conductivity. They provide a non-magnetic bond, high lubricity and a volume resistivity of 50 – 100 ohm-cm.

Kohesi Bond’s superior electrically conductive adhesives, sealants and coatings are extensively used for wire-bonding, die attach, EMI/RFI shielding, electrostatic discharge, grounding and antistatic applications.

POPULAR PRODUCTS

1. TUF 1820 HTS: TUF 1820 HTS is a single component, rapid curing, silver filled, electrically conductive epoxy system. It offers first-rate electrical conductivity and is capable of passing NASA standards for low outgassing (ASTM E-595).

2. KB 1689: KB 1689 is a two component, silver-coated nickel filled, electrically conductive epoxy system. It offers very low volume resistivity, excellent toughness, high peel strength and cryogenic serviceability.

3. KB 1031 ATFL-N: KB 1031 ATFL-N is a unique nickel filled, electrically conductive epoxy system that offers excellent flexibility and elongation. It cures at room temperature and is cryogenically serviceable.

4. KB 1085-1: KB 1085-1 is a graphite filled, electrically conductive system. This two part epoxy offers cost effectiveness, moisture resistance as well as resistance to many chemicals. It is commonly used where non-metallic fillers are required.

5. KB 1686 M: KB 1686 M is a two component nickel filled, electrically conductive epoxy system that offers superior dimensional stability and thermal conductivity. This cost effective epoxy system offers a volume resistivity of 5-10 ohm-cm.

FLAME RETARDANT EPOXIES:

UL 94V-0: Underwriters Laboratories (UL) rates epoxies for their self extinguishing and flame retardant properties by performing extensive testing. These epoxies are useful in special potting and encapsulation applications and are rated up to 90°C. Kohesi Bond formulates customized epoxies that are capable of passing the most stringent UL flame retardant rating i.e. UL 94V-0.

FAR 25.853 (a) is a standard for flame retardancy as defined by the Federal Aviation Regulation to test a material’s compliance for use in airline cabin, cargo and interiors. This test involves burning a cured sample at a specific angle for a defined amount of time. The material’s flame retardancy is then measured in terms of the burn time, length and rate. The test is performed in both horizontal and vertical positions. The vertical test specification is more challenging as compared to the horizontal test specifications. However, depending on your application either one of the test specifications might be sufficient. Kohesi Bond offers innovative products that are capable of meeting these requirements.

POPULAR PRODUCTS

1. KB 1631 FR-2: KB 1631 FR-2 is our two component, room temperature curing epoxy system that offers outstanding flame retardancy. This product is capable of passing UL 94V-0 test specifications, produces very low smoke levels and contains a non-halogen filler.

2. KB 1600 FR-V: KB 1600 FR-V is a specially formulated two-part epoxy based system that is capable of passing the FAR 25.853 (a) vertical test specification. This flame retardant product can be used for bonding, coating, sealing and casting applications.

HIGH STRENGTH ADHESIVES:

Kohesi Bond manufactures first-rate adhesives, sealants, coatings, potting and encapsulation compounds that offer sensational mechanical strength properties. Our highly dedicated team of engineers research and develop custom-made products that meet your specific end-requirements. Kohesi Bond's one and two component epoxy systems offer first-rate tensile, shear, compressive, peel, flexural and cleavage strength. These products are frequently used in the electronics, semiconductor, optical, medical, aerospace, automotive, oil and gas and specialty OEM applications. Our products are capable of meeting various industrial certifications, like NASA low outgassing (ASTM E-595), USP Class VI, ISO 10993-5, halogen free and UL 94 V-0 flame retardance. In addition, they maintain high bond strength at extreme temperatures (including cryogenic) as well as withstand harsh chemicals.

POPULAR PRODUCTS

1. KB 1040-2: KB 1040-2 is our two component, optically clear epoxy system that offers phenomenal tensile and compressive strength properties. It is cryogenically serviceable and offers more than 11,000 psi tensile strength.

2. KB 1040 QF: KB 1040 QF is a two-part, quartz filled epoxy adhesive that is well known for its compressive strength. It offers greater than 18,500 psi compressive strength and superior dimensional stability.

3. TUF 1621 AOHT: TUF 1621 AOHT is a two component go-to epoxy for outstanding mechanical strength properties. It offers a lap shear strength of more than 3,300 psi and first-rate thermal conductivity.

4. KB 1031 ATHT-LO: KB 1031 ATHT-LO is a toughened two-part epoxy that is commonly used for applications requiring low outgassing properties combined with superb peel strength. It offers a peel strength of more than 25 pli.

5. TUF 1820 AOHT: TUF 1820 AOHT is a one component go-to epoxy for excellent thermal conductivity, mechanical strength properties and dimensional stability. This product offers exceptional flexural and lap shear strength (> 3,800 psi).

6. TUF 1452 HT-2: TUF 1452 HT-2 is a two-part, toughened epoxy system that offers unparalleled chemical and high temperature resistance along with excellent bond strength. This product is well known for its cleavage strength and thermal cycling capabilities.

HIGH TEMPERATURE RESISTANT ADHESIVES:

Kohesi Bond offers a broad range of out of the ordinary epoxies and sodium silicate based products that can withstand extremely high temperatures. These high temperature adhesives, sealants, coatings, potting and encapsulation compounds are capable of holding up to temperatures more than 315°C (600°F). Our products are commonly employed in various oil and gas, electronics, medical, aerospace, automotive and optical applications, where good adhesion even at extreme temperatures is absolutely crucial. Depending on your application requirements, our adhesives can be customized to precisely suit them.

POPULAR PRODUCTS

1. KB 1427 HT: KB 1427 HT is a one component, heat curing epoxy system that offers a Tg of more than 220°C. This product gives excellent mechanical strength properties and is serviceable up to 340°C.

2. KB 1031 ATHT-LO: KB 1031 ATHT-LO is a two-part, toughened epoxy system that offers excellent high temperature resistance, peel strength, lap shear strength and impact resistance. In addition, it is capable of passing NASA standards for low outgassing (ASTM E-595).

3. TUF 1452 HT-2: TUF 1452 HT-2 is a two component toughened epoxy system that offers outstanding chemical and moisture resistance and very high temperature resistance properties.

LOW COEFFICIENT OF THERMAL EXPANSION (CTE) EPOXIES:

Coefficient of thermal expansion (CTE) characterizes the fractional change in a material’s size with change in temperature. Highly sensitive optical, aerospace, electronics, semiconductor and specialty OEM applications desire this change in size to be minimal. With the help of special fillers, Kohesi Bond has formulated first-rate epoxy adhesives, sealants and coatings with extremely low coefficients of thermal expansion. Our Low CTE epoxies are capable of passing stringent industrial certifications such as NASA standards for low outgassing (ASTM E-595). These dimensionally stable products offer low shrinkage, outstanding electrical insulation, superior thermal conductivity and phenomenal low and high temperature resistance. Our adhesives can be tailor-fitted to your specific application requirements.

POPULAR PRODUCTS

1. KB 1631 HTC-1: KB 1631 HTC-1 is our two specialty two component epoxy system that offers phenomenal thermal conductivity, dimensional stability and a very low CTE of 15 - 20 × 10-6 in/in/°C. It is cryogenically serviceable and it is capable of passing NASA standards for low outgassing (ASTM E-595).

2. KB 1040 CTE-LO: KB 1040 CTE-LO is a two-part epoxy system suitable for bonding, sealing, coating, potting and encapsulation applications. It offers first-rate thermal conductivity, very low CTE of 15 × 10-6 in/in/°C and can pass NASA standards for low outgassing (ASTM E-595).

3. KB 1458 TC: KB 1458 TC is a unique two-part epoxy system that offers very low thermal resistance, excellent electrical insulation and it can be applied in very thin bond lines. It offers notably low CTE of 12 - 15 × 10-6 in/in/°C.

LOW OUTGASSING ADHESIVES

ASTM E-595 test standard was developed by NASA for evaluating the low outgassing properties of adhesives, sealants, coatings, potting and encapsulation compounds. This special test was designed in order to determine the usefulness of a product for space and high vacuum applications. In addition, Kohesi Bond’s specialty products that are capable of passing this test are also employed in high-end optical and electro-optical applications.

Test Method:

This uncomplicated test begins by first conditioning the sample in a 50% relative humidity chamber for 24 hours. The sample is then placed in a vacuum test chamber at 125°C and a minimum vacuum of 5 × 10-5 torr. The volatiles outgassing the sample are collected on a collector plate cooled at 25°C during this time. The sample and the condensate are then weighed to determine the following:

CVCM: The amount of collected volatile condensable materials (CVCM) on the collector plate.
TML: The amount of total mass loss (TML) by the sample
WVR: The amount of water vapor regained (WVR) by the sample

The material is said to pass or fail the test based on the following conditions:

CVCM < 0.1% and TML < 1% - Pass
CVCM < 0.1% and TML > 1% – Pass if TML – WVR <1%
CVCM > 0.1% or TML – WVR > 1% – Fail

POPULAR PRODUCTS

1. TUF 1820 HTS: TUF 1820 HTS is a one component, silver filled, electrically conductive epoxy system that offers outstanding toughness and is capable of passing NASA standards for low outgassing (ASTM E-595).

2. KB 1031 AT-2LO: KB 1031 AT-2LO is a two-part, thermally conductive, electrically insulative epoxy system. This flexibilized, room temperature curing product is capable of passing NASA standards for low outgassing (ASTM E-595).

KB 1372-LO: KB 1372-LO is a two component epoxy system that offers resistance to high temperatures and withstands harsh chemical environments. In addition, it offers excellent flow properties and it is capable of passing NASA standards for low outgassing.

ONE COMPONENT EPOXY SYSTEMS

One-part epoxies are special polymer systems where the resin and the curing agent are present in the initial mixture. These systems only start polymerizing on application of appropriate curing conditions, typically heat. Kohesi Bond offers a variety of true single component epoxies that have an unlimited working life at room temperature. They do not require any metering or mixing, thus offering high yield and less waste. Our industry ready, no-mix systems are available in varying performance and curing properties. These products can be customized and packaged to meet your specific requirements.

POPULAR PRODUCTS

1. KB 1427 HT: KB 1427 HT is a path-breaking one part epoxy used for bonding, sealing, coating and casting applications. It offers a roaring glass transition temperature Tg of 220°C - 230°C and stellar chemical resistance to a wide variety of fuels, oil and water.

2. KB 1427 HT - 3: Kohesi Bond KB 1427 HT-3 is an exclusive one component epoxy system that can cure completely in 2 – 3 minutes at 150°C. This product’s unlikely low exotherm makes it ideal for use in potting up to 1/4 inch thicknesses. Being a one component system, it requires no mixing and provides ease of application.

3. KB 1613 HT: KB 1613 HT is a one component heat curing epoxy system, that is typically used for bonding, sealing and coating applications. It offers rapid cures at elevated temperatures (5 – 10 minutes at 150°C) as well as outstanding physical strength properties.

4. KB 1613 R80: KB 1613 R80 is a single component epoxy system suitable for bonding, sealing, potting and encapsulation applications. Unlike other one component epoxies, this product can be cured at temperatures as low as 80°C. This product’s exquisite flow properties and lower exotherm makes it ideal for use in potting and encapsulation applications for 1/2” thicknesses and beyond.

KB 1613 RLV: KB 1613 RLV is a true single component system that requires no mixing and cures hard at elevated temperatures. This product’s exquisite flow properties makes it ideal for use in underfill, potting and encapsulation applications. KB 1613 RLV offers phenomenal thermal conductivity of 1 – 1.2 W/m/K.

TWO COMPONENT EPOXY SYSTEMS

Two-part epoxies are special polymer systems where the resin and the curing agent are stored in separate containers. The two components (commonly referred to as Part A and Part B) are required to be mixed in the specified mixing ratio. After mixing, the polymerization occurs readily at ambient temperatures or at elevated temperatures for faster cures. Kohesi Bond offers a wide range of two component epoxies with varying working lives and curing properties. The most significant advantage of these products is their ability to cure at room temperature, thus offering an array of performance properties for applications where adding heat for curing is not feasible. Our products can be customised and packaged to meet your specific requirements. Specialty packaging is also available for automated metering and mixing of the two parts, offering ease of use and higher yields.

POPULAR PRODUCTS

1. KB 1031 ATHT-LO: KB 1031 ATHT-LO is a two component, highly toughened epoxy system suitable for bonding, sealing and coating applications. Remarkably, it offers excellent peel strength and is capable of passing NASA low outgassing test.

2. KB 1631 ANHT: KB 1631 ANHT is a two component, room temperature epoxy system suitable for bonding, sealing and coating. It has a very convenient 1:1 (Part A: Part B) mix ratio by weight or volume. Primarily, it offers stellar thermal conductivity, making it ideal for heat transfer applications.

3. KB 1040 CTE-LO: KB 1040 CTE-LO is an exclusive two component epoxy system suitable for bonding, sealing, coating and encapsulation applications. Remarkably, it offers extremely low coefficient of thermal expansion (CTE) and is capable of passing NASA low outgassing test.

4. KB 1452 HT-2AO: Kohesi Bond KB 1452 HT-2AO is an exclusive two component epoxy system suitable for bonding, sealing, coating, potting and encapsulation applications. It offers excellent thermal conductivity and an extremely low coefficient of thermal expansion (CTE). It also offers astounding chemical resistance to a variety of organic and inorganic acids, solvents, alkalis, aromatic hydrocarbons, oils and water.

5. KB 1458 TC: Kohesi Bond KB 1458 TC is a one-of-a-kind, two component, thermal management epoxy system. Firstly, this product offers phenomenal heat transfer capabilities. This products has very low thermal resistance and can be applied in layers as thin as 10 microns. The efficiency of heat transfer improves exceedingly with lower thermal resistance.

KB 1372 LP: Kohesi Bond KB 1372 LP is a two component, heat curing epoxy system suitable for bonding, sealing, coating and encapsulation. KB 1372 LP is specially formulated for resistance to harsh chemicals. It can hold up to many aggressive chemicals, including water, fuels, oils, solvents, acids and bases. Additionally it is optically clear and cures rigid.